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參數資料
| 型號： | MDM-25SBSP-A174 |
| 廠商： | ITT Corporation |
| 英文描述： | Micro-D PCB - .050 Contact Spacing |
| 中文描述： | 微D板- .050聯系間距 |
| 文件頁數： | 1/4頁 |
| 文件大小： | 197K |
| 代理商： | MDM-25SBSP-A174 |
Micro-D PCB - .050" Contact Spacing
MDM-PCB
How to Order - MDM-PCB Series
18
www.ittcannon.com
Dimensions shown in inch (mm)
Specifications and dimensions subject to change
MDM-PCB connectors are designed for use
with flex circuitry, flat cable and printed circuit
boards or multi-layer boards. They use the
standard MDM metal shell and provide high
density and high reliability in board-to-board,
board-to-cable and cable-to-cable applications.
MDM-PCB connectors are available in 8 shell
sizes with 9 to 100 contacts. Terminations
may be straight (BS) or at 90 right angle (BR,
CBR) board thickness. Jackpost mounting for
use with locking hardware is also available.
SERIES
INSULATOR MATERIAL
CONTACT ARRANGEMENT
CONTACT TYPE
TERMINATION TYPE
MOUNTING HARDWARE (Shell Flange)
MOUNTING HARDWARE FOR PCB
TERMINATION TAIL LENGTH MODIFICATION CODE
SHELL FINISH MODIFICATION CODES
SERIES
MDM - Micro "D" Metal Shell
MOUNTING HARDWARE FOR PCB
T - Threaded Insert
#2-56 Thd for Shell Sizes 9 thru 51
#4-40 Thd for Shell Size 100
No letter - none
TERMINATION TAIL LENGTH MODIFICATION CODE
None - .109 (2.77) ±.015 (0.38) Standard
L61 - .125 (3.18)
L56 - .150 (3.81)
L57 - .190 (4.83)
L39 - .250 (6.35)
L58 - .375 (9.52)
SHELL FINISH MODIFICATION CODES
None - Yellow Chromate/Cadmium over Nickel
A174 - Electroless Nickel
A172 - Gold over Nickel
A141 - Irridite/Alodine
A30 - Black Anodize
INSULATOR MATERIAL
Liquid Crystal Polymer (LCP)
CONTACT ARRANGEMENT
9, 15, 21, 25, 31, 37, 51, and 100
CONTACT TYPE
P - Pin (Plug)
S - Socket (Receptacle)
TERMINATION TYPE
BS - Straight PCB Termination
BR - Right Angle PCB Termination
CBR - Right Angle Narrow Profile PCB Terminations
MOUNTING HARDWARE (Shell Flange)
P
- Jackposts
M7 - Jackposts
M83513/5-07 (Sizes 9-51)
M17 - Jackposts
M83513/5-17 (Size 100)
No letter - none
(For special modification codes, consult
customer service.)
NOTE: Back molding material –
Epoxy Hysol #MG40FS
MDM * -
-
25
P
P
BS
T
L39
A174
RoHS COMPLIANCE
R
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PDF描述 |
|---|---|
| MDM-25SBSP-L58A141 | Micro-D PCB - .050 Contact Spacing |
| MDM-25SBSP-L61 | Micro-D PCB - .050 Contact Spacing |
| MDM-25SBSP-L61A174 | Micro-D PCB - .050 Contact Spacing |
| MDM-25SBSP-T | Micro-D PCB - .050 Contact Spacing |
| MDM-25SBSP-TA174 | Micro-D PCB - .050 Contact Spacing |
相關代理商/技術參數 |
參數描述 |
|---|---|
| MDM-25SBSP-A30 | 制造商:ITT Interconnect Solutions 功能描述:Conn Micro D-Subminiature SKT 25 POS Solder ST Thru-Hole 25 Terminal 1 Port |
| MDM-25SBSP-L17-A174 | 制造商:ITT Interconnect Solutions 功能描述:MDM-25SBSP-L17-A174 - Bulk |
| MDM-25SBSP-L39 | 制造商:ITT Interconnect Solutions 功能描述:Conn Micro D-Subminiature SKT 25 POS Solder ST Thru-Hole 25 Terminal 1 Port |
| mdm-25sbsp-l56 | 制造商:ITT Interconnect Solutions 功能描述:Conn Micro D-Subminiature SKT 25 POS Solder ST Thru-Hole 25 Terminal 1 Port |
| MDM-25SBSP-L56-A174 | 制造商:ITT Interconnect Solutions 功能描述:Conn Micro D-Subminiature SKT 25 POS Solder ST Thru-Hole 25 Terminal 1 Port |
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