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參數(shù)資料
| 型號(hào)： | RF2492 |
| 廠商： | RF MICRO DEVICES INC |
| 元件分類： | 無繩電話/電話 |
| 英文描述： | DUAL-BAND LOW NOISE AMPLIFIER/MIXER |
| 中文描述： | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT |
| 封裝： | 5 X 5 MM, PLASTIC, LCC-32 |
| 文件頁數(shù)： | 1/22頁 |
| 文件大小： | 483K |
| 代理商： | RF2492 |
8-33
8
F
Preliminary
Produc t Desc ription
Ordering Information
Typic al Applic ations
Features
Func tional Block Diagram
RF Micro Devices, Inc.
7625 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs HBT
Si Bi-CMOS
SiGe HBT
GaAs MESFET
Si CMOS
LNA IP SEL
LNA ISET
X2 ENABLE
BAND SEL
IF SEL
32
31
17
10
9
LOGIC
CONTROL
PCS LNA IN
CELL LNA IN
LNA GAIN SEL
MIX GAIN SEL
11
14
12
30
25
23
4
5
7
8
19
20
21
22
1
18
15
PCS LO OUT -
CELL LO OUT+
CELL LO OUT-
PCS LO OUT+
IF1+
IF2+
IF1-
IF2-
L
C
C
X2
P
P
RF2492
DUAL-BAND LOW NOISE AMPLIFIER/MIX ER
TDMA-GSM Cellular/PCS Handsets
TDMA Cellular/PCS Handsets
GAIT Handsets
CDMA Cellular/PCS Handsets
GSM DCS/PCS Handsets
The RF2492 is a fully featured dual-band LNA/Mixer and
is usable in a variety of mobile handset applications. The
unique dual IF outputs provide interface to two indepen-
dent IF SAW filters supporting applications such as
TDMA-EDGE where 30kHz and 200kHz bandwidth SAW
filters are used. With independent power management
control pins for the LNAs and mixers, either IF output can
be accessed from either high- or low-band LNAs, provid-
ing maximum flexibility with minimum power usage. Multi-
ple gain control options are provided to achieve a very
large dynamic range for the receiver. A frequency doubler
is included in the LO circuit to generate both high- and
low-band LO signals with a single VCO. The RF2492 is
packaged in a 32 pin, 5mmx5mm, leadless plastic pack-
age.
Complete Dual-Band Receiver Front End
Low Noise Figure
Stepped LNA/Mixer Gain Control
Adjustable LNA Bias Current/IIP3
Integrated LO Frequency Doubler
Differential LO Buffer Outputs
RF2492
RF2492 PCBA
Dual-Band Low Noise Amplifier/Mixer
Fully Assembled Evaluation Board
8
Rev A4 010828
1.00
0.85
0.80
0.65
5.00
sq.
NOTES:
Shaded Pin is Lead 1.
1
Pin 1 identifier must exist on top surface of package by identification
mark or feature on the package body. Exact shape and size is optional.
Package Warpage: 0.05 mm max.
Die Thickness Allowable: 0.305 mm max.
4
5
2
Dimension applies to plated terminal: to be measured between 0.02 mm
and 0.25 mm from terminal end.
3
0.30
0.18
3
0.60
0.24 typ
0.55
0.30
0.50
0.23
0.13
4 PLCS
0.45
0.20
4 PLCS
0.05
0.01
3.25
2.95 sq.
12°
MAX
Package S tyle: LCC , 32-Pin, 5 x 5
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