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參數資料
| 型號： | S25FL064A0LNAI00 |
| 廠商： | SPANSION LLC |
| 元件分類： | PROM |
| 英文描述： | 64M X 1 FLASH 3V PROM, PDSO16 |
| 封裝： | 0.300 INCH, PLASTIC, MS-013AA, SOP-16 |
| 文件頁數： | 18/36頁 |
| 文件大?。?/td> | 1495K |
| 代理商： | S25FL064A0LNAI00 |
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S25FL064A
S25FL064A_00_C3 June 29, 2007
Da ta
Sh e e t
9.11
Deep Power Down (DP)
The Deep Power Down (DP) command provides the lowest power consumption mode of the device. It is
intended for periods when the device is not in active use, and ignores all commands except for the Release
from Deep Power Down (RES) command. The DP mode therefore provides the maximum data protection
against unintended write operations. The standard standby mode, which the device goes into automatically
when CS# is high (and all operations in progress are complete), should generally be used for the lowest
power consumption when the quickest return to device activity is required.
The host system must drive CS# low, and then write the DP command on SI. CS# must be driven low for the
entire duration of the DP sequence. The command sequence is shown in Figure 9.11 and Table 9.4
The host system must drive CS# high after the device has latched the 8th bit of the DP command, otherwise
the device does not execute the command. After a delay of tDP, the device enters the DP mode and current
Once the device has entered the DP mode, all commands are ignored except the RES command (which
releases the device from the DP mode). The RES command also provides the Electronic Signature of the
device to be output on SO, if desired (see Section 9.12 and 9.12.1).
DP mode automatically terminates when power is removed, and the device always powers up in the standard
standby mode. The device rejects any DP command issued while it is executing a program, erase, or Write
Status Register operation, and continues the operation uninterrupted.
Figure 9.11 Deep Power Down (DP) Command Sequence
CS#
SCK
SI
SO
Standby Mode
Deep Power-down Mode
Command
0
1
2
3
45
6
7
tDP
Hi-Z
Mode 0
Mode 3
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| S25FL064K | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64-Mbit CMOS 3.0 Volt Flash Memory with 80-MHz SPI (Serial Peripheral Interface) Multi I/O Bus |
| S25FL064K0SMFI010 | 功能描述:閃存 IC 64MBIT CMOS 3V FL MEMORY 80-MHZ SPI RoHS:否 制造商:ON Semiconductor 數據總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| S25FL064K0SMFI011 | 功能描述:閃存 IC 64MBIT CMOS 3V FL MEMORY 80-MHZ SPI RoHS:否 制造商:ON Semiconductor 數據總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| S25FL064K0SMFI013 | 制造商:Spansion 功能描述:FLASH SERL-SPI 3V/3.3V 64MBIT - Bulk |
| S25FL064LABBHI020 | 功能描述:IC FLASH NOR 24FBGA 制造商:cypress semiconductor corp 系列:FL-L 包裝:托盤 零件狀態:在售 存儲器類型:非易失 存儲器格式:閃存 技術:FLASH - NOR 存儲容量:64Mb （8M x 8） 時鐘頻率:108MHz 寫周期時間 - 字，頁:- 存儲器接口:SPI - 四 I/O， QPI 電壓 - 電源:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C（TA） 安裝類型:表面貼裝 封裝/外殼:24-TBGA 供應商器件封裝:24-BGA（6x8） 標準包裝:338 |
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