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參數資料
型號: S29AL032D90TFI043
廠商: SPANSION LLC
元件分類: PROM
英文描述: 32 Megabit CMOS 3.0 Volt-only Flash Memory
中文描述: 2M X 16 FLASH 3V PROM, 90 ns, PDSO48
封裝: LEAD FREE, MO-142DD, TSOP-48
文件頁數: 59/67頁
文件大小: 1708K
代理商: S29AL032D90TFI043
60
S29AL032D
S29AL032D_00_A8 November 2, 2006
Da ta
Sh e e t
18. Erase and Programming Performance
Notes
1. Typical program and erase times assume the following conditions: 25
°C, V
CC = 3.0 V, 100,000 cycles, checkerboard data pattern.
2. Under worst case conditions of 90°C, VCC = 2.7 V, 1,000,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maximum
program times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 11.2 for further information on
command definitions.
6. The device has a minimum erase and program cycle endurance of 100,000 cycles per sector.
7. At extended temperature range (>+85°C), typical erase time is 1.75 s and maximum erase time is 25 s.
8. At extended temperature range (>+85°C), typical erase time is 112 s.
19. TSOP and BGA Pin Capacitance
Notes
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
Parameter
Unit
Comments
Sector Erase Time (Note 7)
0.7
10
s
Excludes 00h programming
prior to erasure (Note 4)
Chip Erase Time (Note 8)
45
s
Byte Programming Time
9
300
s
Excludes system level overhead
Word Programming Time
11
360
s
Accelerated Byte/Word Programming Time
7
210
s
Chip Programming Time
Byte Mode
36
108
s
Word Mode
24
72
s
Parameter Symbol
Parameter Description
Test Setup
Package
Typ
Max
Unit
CIN
Input Capacitance
VIN = 0
TSOP
6
7.5
pF
BGA
4.2
5.0
pF
COUT
Output Capacitance
VOUT = 0
TSOP
8.5
12
pF
BGA
5.4
6.5
pF
CIN2
Control Pin Capacitance
VIN = 0
TSOP
7.5
9
pF
BGA
3.9
4.7
pF
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