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參數資料
型號: S29AL032D90TFI043
廠商: SPANSION LLC
元件分類: PROM
英文描述: 32 Megabit CMOS 3.0 Volt-only Flash Memory
中文描述: 2M X 16 FLASH 3V PROM, 90 ns, PDSO48
封裝: LEAD FREE, MO-142DD, TSOP-48
文件頁數: 8/67頁
文件大小: 1708K
代理商: S29AL032D90TFI043
14
S29AL032D
S29AL032D_00_A8 November 2, 2006
Da ta
Sh e e t
7.6
Standby Mode
When the system is not reading or writing to the device, it can place the device in the standby mode. In this
mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state,
independent of the OE# input.
The device enters the CMOS standby mode when the CE# and RESET# pins are both held at VCC ± 0.3 V.
(Note that this is a more restricted voltage range than VIH.) If CE# and RESET# are held at VIH, but not within
VCC ± 0.3 V, the device will be in the standby mode, but the standby current will be greater. The device
requires standard access time (tCE) for read access when the device is in either of these standby modes,
before it is ready to read data.
If the device is deselected during erasure or programming, the device draws active current until the operation
is completed.
In the DC Characteristics table, ICC3 and ICC4 represents the standby current specification.
7.7
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables
this mode when addresses remain stable for tASM. The automatic sleep mode is independent of the CE#,
WE#, and OE# control signals. Standard address access timings provide new data when addresses are
changed. While in sleep mode, output data is latched and always available to the system. ICC4 in DC
Characteristics on page 46 represents the automatic sleep mode current specification.
7.8
RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of resetting the device to reading array data. When the system
drives the RESET# pin to VIL for at least a period of tRP, the device immediately terminates any operation in
progress, tristates all data output pins, and ignores all read/write attempts for the duration of the RESET#
pulse. The device also resets the internal state machine to reading array data. The operation that was
interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure
data integrity.
Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS±0.3 V, the device
draws CMOS standby current (ICC4). If RESET# is held at VIL but not within VSS±0.3 V, the standby current
will be greater.
The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash
memory, enabling the system to read the boot-up firmware from the Flash memory.
If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a 0 (busy) until the
internal reset operation is complete, which requires a time of tREADY (during Embedded Algorithms). The
system can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is
asserted when a program or erase operation is not executing (RY/BY# pin is 1), the reset operation is
completed within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after the
RESET# pin returns to VIH.
Refer to AC Characteristics on page 49 for RESET# parameters and to Figure 17.2 on page 50 for the timing
diagram.
7.9
Output Disable Mode
When the OE# input is at VIH, output from the device is disabled. The output pins are placed in the high
impedance state.
Table 7.2 Automatic Sleep Mode Timing
Parameter
Description
Max.
Unit
tASM
Automatic Sleep Mode
tACC+30
ns
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