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參數(shù)資料
| 型號(hào)： | 0034.5605.11 |
| 廠商： | SCHURTER INC |
| 元件分類： | 保險(xiǎn)絲 |
| 英文描述： | TIME LAG BLOW ELECTRIC FUSE, 0.063A, 250VAC, 35A (IR), SURFACE MOUNT |
| 封裝： | ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 1/3頁(yè) |
| 文件大小： | 414K |
| 代理商： | 0034.5605.11 |
Non resettable fuses
SMD-FST
Fuses
Surface Mount Fuse, 5 x 20 mm, Time-Lag T, L, 250 VAC, Au plating
IEC 60127-2 250VAC Time-Lag T
Description
-Directlysolderableonprintedcircuitboards
-L=LowBreakingCapacity
-Forratedcurrent1Ato16A,SMD-SPTisrecommended
Standards
-IEC60127-2/3
-UL248-14
-CSAC22.2no.248.14
Approvals
-VDECertificateNumber:40011522
-ULFileNumber:E41599
Applications
-PrimaryProtectiononSMDPCB
References
Weblinks
Technical Data
RatedVoltage
250VAC
RatedCurrent
0.05-20A
BreakingCapacity
35A-125A
Characteristic
Time-LagT
Mounting
PCB,SMT
AdmissibleAmbientAirTemp. -55°Cto125°C
ClimaticCategory
55/125/21acc.toIEC60068-1
Material:Housing
Glass
Material:Terminals
Gold-PlatedCopperAlloy
UnitWeight
1.05g
StorageConditions
0°Cto60°C,max.70%r.h.
ProductMarking
,Current,Voltage,Characteristic,
BreakingCapacity
SolderingMethods
Reflow
Solderability
245°C/3secacc.toIEC60068-2-58,
TestTd
ResistancetoSolderingHeat
260°C/10secacc.toIEC60068-2-58,
TestTd
ResistancetoVibration
acc.toIEC60068-2-6,testFc
LoadHumidityTest
MIL-STD-202,Method103B
(1000h@0.1*In@0.85r.H.@85°C)
MoistureResistanceTest
MIL-STD-202,Method106E
(50cyclesinatemp./misterchamber)
TerminalStrength
MIL-STD-202,Method211A
(Deflectionofboard1mmfor1minute)
ThermalShock
MIL-STD-202,Method107D
(200air-to-aircyclesfrom-55to
+125°C)
CaseResistance
acc.toEIA/IS-722,Test4.7
>100M
Ω(betweenleedsandbody)
ResistancetoSolvents
MIL-STD-202,Method215A
Dimensions
20mm
10
5.2
20
+0.1 -0.2
±0.5
±0.2
5.5
5
9.5
Solderingpads
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