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參數(shù)資料
| 型號： | 02351.25MXEP |
| 元件分類： | 保險絲 |
| 英文描述： | FAST BLOW ELECTRIC FUSE, 1.25A, 250VAC, 100A (IR), THROUGH HOLE |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 3/4頁 |
| 文件大小： | 165K |
| 代理商： | 02351.25MXEP |
Revised: January 7, 2009
295
2009 Littelfuse, Inc.
Specications are subject to change without notice.
Axial Lead & Cartridge Fuses
235 Series
5×20 mm > Fast-Acting > 235 Series
Please refer to www.littelfuse.com/series/235.html for current information.
235
Series
Materials
Body: Glass
Cap: Nickel–plated brass
Leads: Tin–plated Copper
Terminal Strength
MIL-STD-202G, Method 211A.
Test Condition A
Solderability
Reference IEC 60127 Second Edition
2003-01 Annex A
Product Marking
Cap 1: Brand logo, current and voltage
rating
Cap 2: Series and agency approval
markings
Packaging
Available in Bulk (M=1000 pcs/pkg) or on
Tape/Reel (MRET1=1000 pcs/reel)
Product Characteristics
Operating Temperature
–55C to +125C
Thermal Shock
MIL-STD-202G, Method 107G, Test
Condition B: (5 cycles –65OC +
125OC)
Vibration
MIL-STD-202G, Method 201A
Humidity
MIL-STD-202G, Method 103B, Test
Condition A high RH (95%) and
elevated temperature (40O C) for 240
hours
Salt Spray
MIL-STD-202G, Method 101D, Test
Condition B
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
4
0
5
0
60
70
80
90
100
110
120
130
1
4
0
1
5
0
160
170
180
190
200
210
220
230
2
4
0
Time (Seconds)
T
emperature
(°C)
-
Measured
on
bottom
side
of
board
Cooling Time
Preheat Time
Wave Parameter
Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Temperature Minimum:
100
° C
Temperature Maximum:
150
° C
Preheat Time:
60-180 seconds
Solder PotTemperature:
260
° C Maximum
Solder DwellTime:
2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reow process.
Recommended Process Parameters:
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