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參數(shù)資料
| 型號(hào)： | 0314030.HXP |
| 元件分類： | 保險(xiǎn)絲 |
| 英文描述： | FAST BLOW ELECTRIC FUSE, 30A, 250VAC, 125VDC, 100A (IR), INLINE/HOLDER |
| 封裝： | ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 2/3頁(yè) |
| 文件大小： | 158K |
| 代理商： | 0314030.HXP |
Introduction to Circuit Protection
Introduction to Circuit Protection
Transientology
324
2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Axial Lead & Cartridge Fuses
314/324 Series
3AB > Fast-Acting > 314/324 Series
Please refer to www.littelfuse.com/series/314.html
or /324.html for current information.
Average Time Current Curves
1000
100
10
1
0.1
0.01
0.1
1
10
100
1000
.375A
.500A
.750A
1A
2A
3A 4A 5A 6A 7A 8A 10A 12A 15A
20A 25A 30A 40A
TIME
IN
SECONDS
CURRENT IN AMPERES
Temperature Rerating Curve
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
4
0
50
60
70
80
90
100
110
120
130
1
4
0
150
160
170
180
190
200
210
220
230
2
4
0
Time (Seconds)
T
emperature
(°C)
-
Measured
on
bottom
side
of
board
Cooling Time
Preheat Time
Wave Parameter
Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Temperature Minimum:
100
° C
Temperature Maximum:
150
° C
Preheat Time:
60-180 seconds
Solder PotTemperature:
260
° C Maximum
Solder DwellTime:
2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Note: These devices are not recommended for IR or
Convection Reflow process.
Recommended Process Parameters:
相關(guān)PDF資料 |
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| 0314030.MXP | FAST BLOW ELECTRIC FUSE, 30A, 250VAC, 125VDC, 100A (IR), INLINE/HOLDER |
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