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參數資料
| 型號： | 0315030.HXP |
| 元件分類： | 保險絲 |
| 英文描述： | TIME LAG BLOW ELECTRIC FUSE, 30A, 32VAC, 300A (IR), THROUGH HOLE |
| 封裝： | ROHS COMPLIANT |
| 文件頁數： | 3/4頁 |
| 文件大?。?/td> | 161K |
| 代理商： | 0315030.HXP |
Revised: January 7, 2009
319
2009 Littelfuse, Inc.
Specications are subject to change without notice.
Axial Lead & Cartridge Fuses
313/315 Series
Please refer to www.littelfuse.com/series/313.html
or /315.html for current information.
313/315
Series
Average Time Current Curves
1000
100
10
1
0.1
0.01
1/16A
0.05 0.1
1
10
100
1000
1/10A 15
/10
0
.17
5A
1/4A 3/8A 1/2A 3/4A 1A 11/2
A
2A 3A 4A 5A 7A 8A 10A 12A 15
A
20A
30A
25
A
TIME
IN
SECONDS
CURRENT IN AMPERES
Temperature Rerating Curve
A
B
A
B
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
4
0
5
0
60
70
80
90
100
110
120
130
1
4
0
1
5
0
160
170
180
190
200
210
220
230
2
4
0
Time (Seconds)
T
emperature
(°C)
-
Measured
on
bottom
side
of
board
Cooling Time
Preheat Time
Wave Parameter
Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Temperature Minimum:
100
° C
Temperature Maximum:
150
° C
Preheat Time:
60-180 seconds
Solder PotTemperature:
260
° C Maximum
Solder DwellTime:
2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reow process.
Recommended Process Parameters:
A - For 313/315 Series, from 10mA to 150mA
B - For all other ampere ratings of 313/315 series
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