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參數(shù)資料
| 型號(hào)： | 0326.375MXP |
| 元件分類： | 保險(xiǎn)絲 |
| 英文描述： | TIME LAG BLOW ELECTRIC FUSE, 0.375A, 250VAC, 250VDC, 100A (IR), INLINE/HOLDER |
| 封裝： | ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 3/4頁(yè) |
| 文件大小： | 166K |
| 代理商： | 0326.375MXP |
331
2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Axial Lead & Cartridge Fuses
325/326 Series
3AB > Time Lag > 325/326 Series
Please refer to www.littelfuse.com/series/325.html
or /326.html for current information.
325/326
Series
Average Time Current Curves
1000
100
10
1
0.1
0.01
10
CURRENT IN AMPERES
TIME
IN
SECONDS
100
1000
0.1
1
0.05
5.0A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1.0A
.750A
.500A
.375A
20.0A
15.0A
12.0A
10.0A
8.0A
7.0A
6.25A
30.0A
25.0A
Temperature Rerating Curve
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
5
0
60
70
80
90
100
110
120
130
140
1
5
0
160
170
180
190
200
210
220
230
240
Time (Seconds)
T
emperature
(°C)
-
Measured
on
bottom
side
of
board
Cooling Time
Preheat Time
Wave Parameter
Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Temperature Minimum:
100
° C
Temperature Maximum:
150
° C
Preheat Time:
60-180 seconds
Solder PotTemperature:
260
° C Maximum
Solder DwellTime:
2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Note: These devices are not recommended for IR or
Convection Reflow process.
Recommended Process Parameters:
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 0326.400HXP | TIME LAG BLOW ELECTRIC FUSE, 0.4A, 250VAC, 250VDC, 100A (IR), INLINE/HOLDER |
| 0326.400MXP | TIME LAG BLOW ELECTRIC FUSE, 0.4A, 250VAC, 250VDC, 100A (IR), INLINE/HOLDER |
| 0326.500HXP | TIME LAG BLOW ELECTRIC FUSE, 0.5A, 250VAC, 250VDC, 100A (IR), INLINE/HOLDER |
| 0326.500MXP | TIME LAG BLOW ELECTRIC FUSE, 0.5A, 250VAC, 250VDC, 100A (IR), INLINE/HOLDER |
| 0326.600HXP | TIME LAG BLOW ELECTRIC FUSE, 0.6A, 250VAC, 250VDC, 100A (IR), INLINE/HOLDER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 0326-4-19-00-00-00-10-0 | 功能描述:電路板硬件 - PCB SWAGE MNT PIN RECPT RoHS:否 制造商:Harwin 類型:Shield Clip 長(zhǎng)度:9.4 mm 螺紋大小: 外徑: 材料:Beryllium Copper 電鍍:Tin |
| 0326-4-19-01-06-01-10-0 | 功能描述:電路板硬件 - PCB 200u SN/PB OVER NI 6 CON RoHS:否 制造商:Harwin 類型:Shield Clip 長(zhǎng)度:9.4 mm 螺紋大小: 外徑: 材料:Beryllium Copper 電鍍:Tin |
| 0326-4-19-01-06-14-10-0 | 制造商:Mill-Max Mfg Corp 功能描述:Contact SKT Solder ST Thru-Hole Bulk |
| 0326-4-19-01-06-27-10-0 | 功能描述:電路板硬件 - PCB 200u SN/PB OVER NI 6 CON RoHS:否 制造商:Harwin 類型:Shield Clip 長(zhǎng)度:9.4 mm 螺紋大小: 外徑: 材料:Beryllium Copper 電鍍:Tin |
| 0326-4-19-15-06-14-10-0 | 制造商:Mill-Max Mfg Corp 功能描述:0326-4-19-15-06-14-10-0 |
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