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參數(shù)資料
| 型號： | 0402SFF150F/24 |
| 元件分類： | 保險絲 |
| 英文描述： | FAST BLOW ELECTRIC FUSE, 1.5A, 24VDC, SURFACE MOUNT |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 5/6頁 |
| 文件大小： | 281K |
| 代理商： | 0402SFF150F/24 |
103
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C
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ip
F
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11
Insulation resistance after opening
20,000
minimum @ rated voltage. Fuse clearing under low voltage conditions may result in lower -
post-clearing insulation values. Under normal fault conditions values. Under normal fault conditions
Raychem fuses provide sufficient insulation resistance for circuit protection.
Current carrying capacity
Withstands 100% rated current at +25°C ambient for 4 hours when evaluated per MIL-PRF-23419.
0402 (1005)
10,000
178mm white plastic
9.0 ± 0.5mm
8.00 ± 0.10mm
Paper
55
0603 (1608)
4,000
178mm white plastic
9.0 ± 0.5mm
8.00 ± 0.10mm
Plastic
55
1206 (3216)
3,000
178mm white plastic
9.0 ± 0.5mm
8.00 ± 0.10mm
Plastic
55
Electrical Specifications for Fast-Acting Chip Fuses
Table FF5
Packaging Information for Fast-Acting Chip Fuses
Table FF6
Range
Performance
Testing Method
Min.
Max.
MVR
ASTM D1238
3.60
4.40
Vicat softening temperature
ASTM D1525
97.8
-
Elasticity at break
ASTM D638
50.0
-
Tape and Reel Material Characteristics for Fast-Acting Chip Fuses
Table FF7
Tape and Reel Specifications for Fast-Acting Chip Fuses
Table FF8
Size
Reel Quantity
(pcs)
Reel Diameter
Reel Width
Carrier
Tape Size
Tape Type
Reels per Outside
Shipment Box
Outside Shipment
Boxes per Overpack
Dimension in inches (mm)
Mark
0402 (1005)
0603 (1608)
1206 (3216)
E1
0.069±0.004
(1.75±0.10)
0.069±0.004
(1.75±0.10)
0.069±0.004
(1.75±0.10)
F
0.138±0.002
(3.50±0.05)
0.138±0.002
(3.50±0.05)
0.138±0.002
(3.50±0.05)
W
0.318±0.004
(8.00±0.10)
0.318±0.004
(8.00±0.10)
0.318±0.004
(8.00±0.10)
P1
0.079±0.004
(2.00±0.10)
0.157±0.004
(4.00±0.10)
0.157±0.004
(4.00±0.10)
P0
0.157±0.004
(4.00±0.10)
0.157±0.004
(4.00±0.10)
0.157±0.004
(4.00±0.10)
P2
0.040±0.002
(1.00±0.05)
0.079±0.002
(2.00±0.05)
0.079±0.002
(2.00±0.05)
D0
0.059±0.004
(1.50+0.10/-0.00)
0.059±0.004
(1.50+0.10/-0.00)
0.059±0.004
(1.50+0.10/-0.00)
D1
--
-
0.039 max
(1.00 max)
t
0.009±0.001
(0.23±0.02)
0.009±0.001
(0.23±0.02)
0.009±0.001
(0.23±0.02)
A0
0.026±0.004
(0.67±0.10)
0.036±0.004
(0.92±0.10)
0.071±0.004
(1.80±0.10)
B0
0.046±0.004
(1.17±0.10)
0.071±0.004
(1.80±0.10)
0.138±0.004
(3.50±0.10)
K0
0.025±0.004
(0.63±0.10)
0.033±0.004
(0.85±0.10)
0.050±0.004
(1.27±0.10)
Tolerance X ± 1mm; 0.X ± 0.5mm; 0.XX ± 0.2mm
Recommended conditions for hand soldering:
1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended,
do not directly contact the chip termination with the tip of soldering iron.
2. Preheating: 150°C, 60s (min).
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s.
Maximum temperature of soldering iron tip/soldering time: 350°C /9s or 400°C / 8s.
T
e
m
p
e
ra
tu
re
(
C
)
Time (s)
Soldering
10s Max.
Natural
Cooling
260
230
150-180
Preheat 60 - 120s Min.
40s Max.
Recommended Soldering Temperature Profile for Fast-Acting Chip Fuses
Figure FF8
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