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參數資料
| 型號： | 0456040.ER |
| 元件分類： | 保險絲 |
| 英文描述： | ELECTRIC FUSE, 40A, 60VDC, 600A (IR), SURFACE MOUNT |
| 封裝： | HALOGEN FREE AND ROHS COMPLIANT |
| 文件頁數： | 2/3頁 |
| 文件大?。?/td> | 429K |
| 代理商： | 0456040.ER |
Introduction to Circuit Protection
Introduction to Circuit Protection
Transientology
66
2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Surface Mount Fuses
456 Series
NANO2 > 456 Series
Please refer to www.littelfuse.com/series/456.html for current information.
Average Time Current Curves
Temperature Rerating Curve
PERCENT
OF
UPRA
TING
PERCENT
OF
DOWNUPRA
TING
AMBIENT TEMPERATURE
248°F
212°F
176°F
140°F
104°F
68°F
32°F
-4°F
-40°F
-76°F
120°C
264°F
140°C
100°C
80°C
60°C
40°C
20°C
0°C
-20°C
-40°C
-60°C
0
20
40
60
20
40
60
Soldering Parameters – Reflow Soldering
reflow condition
Pb–Freeassembly
pre Heat
-temperature min (t
s(min))
150°C
-temperature max (t
s(max))
200°C
-time (min to max) (t
s)
60–180secs
Average ramp up rate (liquidustemp
(t
l) to peak
5°C/second max.
t
S(max) to tl - ramp-up rate
5°C/second max.
reflow
-temperature (t
l) (liquidus)
217°C
-temperature (t
l)
60–150seconds
peaktemperature (t
p)
250+0/-5 °C
time within 5°c of actual peak
temperature (t
p)
20–40seconds
ramp-down rate
5°C/second max.
time 25°c to peaktemperature (t
p)
8 minutes max.
Do not exceed
260°C
Time
Te
mperatur
e
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
(t 25C to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
TL to TP
0.01
0.1
1
10
100
1
10
100
1000
TIME
IN
SECONDS
CURRENT IN AMPS
40A
30A
20A 25A
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相關代理商/技術參數 |
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|---|---|
| 045605-0269 | 制造商:ITT Interconnect Solutions 功能描述:KPT45605-269 - Bulk |
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| 0456090001 | 制造商:Molex 功能描述:Conn Housing RCP 16 POS 2.5mm Crimp ST Bag 制造商:Molex 功能描述:SPOX BMI RECEPT. 16 CKT. 制造商:Molex 功能描述:SPOX BMI RECEPT 16 CKT |
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