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參數(shù)資料
型號: 10-8120
廠商: GC Electronics
文件頁數(shù): 1/2頁
文件大小: 0K
描述: GREASE HTSINK TYP44 NONSIL 1.0OZ
MSDS 材料安全數(shù)據(jù)表: 10-81(18,20,26) MSDS
標準包裝: 1
系列: 型 44
類型: 潤滑脂
尺寸/尺寸: 1.0 oz. 管裝
其它名稱: Q1140052
PRODUCT SPECIFICATIONS SHEET
CAT NO.
PRODUCT NAME
10-8118
Type 44 Non-Silicone
10-8120
10-8126
DESCRIPTION:
Type 44 Heat Sink Compound is a non-silicone based, grease-like material specially blended with
thermally conductive fine metal oxide powders. Compounded from 100% synthetic base stocks, it is
designed as an alternative to silicone type heat sink compounds. This material features outstanding heat
transfer efficiency, viscosity, high dielectric strength and thermal stability.
APPLICATION:
Commonly used at the junction between a heat producing electrical device and the cooling medium, Type
44 Heat Sink Compound facilitates the transfer and removal of the damaging heat. The compound clings to
all metal surfaces and will not melt, bleed or harden over time. This product can be used anywhere a
silicone heat sink is used without the fear of silicone fluid migration.
TYPICAL PROPERTIES:
Property
Test Method
Condition
Result
Appearance
White, Smooth Grease
Worked Penetration
ASTM D-217
60 Strokes, 77
°F
260
Specific Gravity
25
°C/25°C
2.5
Bleed, %
FTM-791-321-3
24 hrs @ 200
°C
<0.5
Evaporation, %
FTM-791.321-3
24 hrs @ 200
°C
0.1
Temperature Range,
°F (°C)
-22 to 390 (-30 to 200)
Dropping Point,
°F (°C)
ASTM D-2265
>500 (260)
Thermal Conductivity, g-cal/sec/cm2/
°C/cm Modified D.S.C.
36
°C @ 1 sec
1.8 X 10-3
W/m.
°K
.7537
Dielectric Strength, volts/mil
ASTM D149
0.010” gap
645
0.050” gap
420
Dielectric Constant
ASTM D-150
50 Hz
4.5
1000 Hz
4.5
Dissipation Factor
ASTM D-150
50 Hz
0.0029
1000 Hz
0.0029
Volume Resistivity, ohm.cm
ASTM D-257
RT
1 x 1015
HOW TO USE:
Type 44 can be applied by various methods including automated pumping systems, by hand, by brushing,
or by wiping. Type 44 can be applied by spraying or dipping by lowering the consistency of the product by
diluting the compound with solvents such as mineral spirits, xylene, methyl ethyl ketone, toluene, and
chlorinated ethanes.
ELECTRONICS
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