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參數(shù)資料
型號： 100500F00000G
廠商： Aavid Thermalloy
文件頁數(shù)： 69/116頁
文件大小： 0K
描述： THERMAL GREASE
MSDS 材料安全數(shù)據(jù)表： Ther-O-Link 1000
標準包裝： 1
系列： Therolink 1000
類型： 硅合成物
尺寸/尺寸： 5 oz. 管裝
其它名稱： 000006
56
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
5297, 5298, 5299, 5300
Extruded heat sink with large radial fins
Extruded heat sink with large radial
fins features equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220, TO-218, and TO-247 devices.
3.18
(0.125)
14.22
(0.560)
13.72
(0.540)
25.40
(1.000)
"C"
"A"
"B"
20.96
(0.825)
41.91
(1.650)
17.02
(0.670)
1.57
(0.062)
3.96
(0.156)
25.40
(1.000)
2.36
(0.093)
2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
52980X
52970X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Device
“A” Dim
“B” Dim
“C” Dim
529701B02500G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529702B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
529801B02500G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529802B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
529901B02500G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529902B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
530001B02500G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
530002B02500G
TO-220
63.50 (2.500)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
53000X
52990X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
For additional options see page 83
TO-220 & TO-218 & TO-247 Heat Sinks
SW25, SW38, SW50, SW63
Extruded heat sink with unequal channel widths
Extruded heat sink with unequal
channel widths front and back
can accommodate a TO-220, TO-218,
or TO-247 devices. Includes two solder-
able mounting pins which permit verti-
cal mounting and eliminate stress on
device leads. Available in three heights.
Version without hole uses clip 5901
(sold separately) to attach device.
See page 97 for clip information.
25.00
(0.984) 19.90
(0.783)
15.00
(0.591)
4.00
(0.157)
2.50
(0.098)
25.40
(1.000)
3.20
(0.126)
"A"
SEE NOTE 1
TYP
34.50
(1.358)
12.50
(0.492)
6.25
(0.246)
2.00
(0.079)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
SW38
SW25
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
“A” Dim
Holes
SW25-2G
Extruded heat sink with unequal channel widths front and back
25.00 (0.984)
No
3.00 (0.118)
SW25-4G
With device mounting holes
25.00 (0.984)
Yes
3.00 (0.118)
SW38-2G
Extruded heat sink with unequal channel widths front and back
38.00 (1.496)
No
3.00 (0.118)
SW38-4G
With device mounting holes
38.00 (1.496)
Yes
3.00 (0.118)
SW50-2G
Extruded heat sink with unequal channel widths front and back
50.00 (1.968)
No
3.00 (0.118)
SW50-4G
With device mounting holes
50.00 (1.968)
Yes
3.00 (0.118)
SW63-2G
Extruded heat sink with unequal channel widths front and back
63.00 (2.480)
No
3.00 (0.118)
SW63-4G
With device mounting holes
63.00 (2.480)
Yes
3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
SW63
SW50
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
NOTE 1: This hole not present in SW25 model
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相關代理商/技術參數(shù)
參數(shù)描述
100501 制造商:Brady Corporation 功能描述:
100-501 制造商:TE Connectivity 功能描述:CURRENT TRANSFORMER; Input Current:500A; Turns Ratio:500:5; Frequency Min:50Hz; Frequency Max:400Hz; Secondary Burden Resistance:0.166ohm; Transformer Mounting:Panel; Current Ratio:500:5 A; Frequency Range:50Hz to 400Hz; Series:100 ;RoHS Compliant: NA
100501-2 制造商:TE Connectivity 功能描述:Z-PACK MALE CONTACT - Bulk
10-0501-20 功能描述:IC 與器件插座 STRIP LINE BIFURCATE 10 PINS TIN RoHS:否 制造商:Molex 產品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
10-0501-21 功能描述:IC 與器件插座 STRIP LINE BIFURCATE 10 PINS GOLD RoHS:否 制造商:Molex 產品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
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