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參數資料
型號： 125700D00000G
廠商： Aavid Thermalloy
文件頁數： 78/116頁
文件大小： 0K
描述： SOLDER ANCHOR FOR BGA HEATSINKS
標準包裝： 1,000
附件類型： 焊錨（需要 2 個）
適用于相關產品： BGA 散熱片
產品目錄頁面： 2673 (CN2011-ZH PDF)
其它名稱： HS400
64
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-202 Heat Sinks
ORDERING INFORMATION
5769, 5773, 5774 Slim low profile channel style heat sink
Slim low profile channel style
heat sink is notched to accom-
modate the TO-202 center tab
packages. Available in 3 heights.
3.81
(0.150)
THRU
13.34
(0.525)
19.05
(0.750)
"A"
13.21
(0.520)
3.81
(0.150)
REF
Part Number
“A” Dim
576904B00000G
6.35 (0.250)
577304B00000G
9.53 (0.375)
577404B00000G
12.70 (0.500)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
ro
m
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
20
0
20
40
60
80
100
01
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
577304
577404
576904
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
50.80
(2.000)
25.40
(1.000)
35.05
(1.380)
12.70
(0.500)
17.87
(0.704)
4.75
(0.187)
3.15
(0.124)
9.35
(0.368)
2.46
(0.097)
1.27
(0.050)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Space saving heat sink features
staggered fins for increased cooling
efficiency. This verticle mount heat
sink features integrated matte tin
plated tabs to solder directly to the
PC board.
6034
Space saving staggered fin heat sink
6046, 6047
Compact slide on heat sink
makes assembly easy. The 6046
features a positive device catch
to lock the heat sink to the device.
15.24
(0.600)
7.62
(0.300)
O.D.
6.35
(0.250)
21.59
(0.850)
"A"
REF
SECTION A–A
10.41
(0.410)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
01
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
Figure
6046PBG
With device catch
A
6047PBG
Compact slide on heat sink
B
ORDERING INFORMATION
15.24
(0.600)
7.62
(0.300)
O.D.
6.35
(0.250)
21.59
(0.850)
"A"
REF
SECTION A–A
10.41
(0.410)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Copper
Finish: Tin Plated
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre-Black Anodize*
ORDERING INFORMATION
Part Number
Description
6034DG
Space saving staggered fin heat sink with
3.10 (0.122)
integrated tin plated tabs
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
FIGURE A
FIGURE B
For additional options see page 84
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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