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參數(shù)資料
| 型號： | 14-307799-11 |
| 廠商： | ARIES ELECTRONICS INC |
| 元件分類： | 插座 |
| 英文描述： | BGA12-DIP14, IC SOCKET |
| 文件頁數(shù)： | 1/1頁 |
| 文件大小： | 100K |
| 代理商： | 14-307799-11 |
14-307799-11
12 Ball MicroBGA to 14 Pin .3 Dip Adapter
Note: Aries specializes in custom design and production. In addition to the stan-
dard products shown on this page, special materials, platings, sizes, and configu-
rations can be furnished, depending on quantities. Aries reserves the right to
change product specifications without notice.
FEATURES:
A cost effective means of bread boarding μBGA packages.
Available on .300 [7.62] centers.
GENERAL SPECIFICATIONS:
Board material is .062 thick FR406 high temp material
with 1 oz. Copper traces, both sides. Finished with ENIG
(Gold over Nickel).
Pins are Brass Alloy 360 1/2 hard per UNS C36000
ASTM-B16-00.
Pin Plating is 200μ”[5.08μm] min. 93/7 Tin Lead per ASTM
B545 over 100μ”[2.54μm] min. Nickel per SAE-AMS-QQ-
N-290.
Max Temperature 170°C Tg.
MOUNTING CONSIDERATIONS:
Suggested PCB hole size = ±.003 [.71±.08] dia.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ORDERING INFORMATION
All tolerances ± .005 [.13]
unless otherwise specified
NORTH AMERICA
Frenchtown, NJ USA
TEL:(908) 996-6841
FAX:(908) 996-3891
EUROPE
TEL: +44 870 240 0249
FAX: +44 871 919 6033
europe@arieselec.com
http://www.arieselec.com info@arieselec.com
abc
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
14-307799-11
Connection List
A1
13
A2
12
A3
11
A4
10
B1
1
B2
2
B3
9
B4
8
C1
3
C2
4
C3
5
C4
6
18099
Rev.A
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