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參數資料
型號: 144-PGM15048-30
廠商: ARIES ELECTRONICS INC
元件分類: 插座
英文描述: PGA144, IC SOCKET
文件頁數: 1/1頁
文件大小: 295K
代理商: 144-PGM15048-30
Part No. 96-144M65 - QFP to PGA Adapter
for 144 Position, .0256 [.65] Pitch
Note: Aries specializes in custom design and production. In addition to the
standard products shown on this page, special materials, platings, sizes, and
configurations can be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
FEATURES:
Convert surface mount QFP packages to a 15 x 15 PGA
footprint.
Reduce costs by using less expensive QFP packages to
replace PGA footprints in existing designs.
Pins are mechanically fastened and soldered to board using
Aries’ patented process, creating a reliable electrical connec-
tion and rugged contact.
Consult factory for panelized form or for mounting of
consigned chips.
SPECIFICATIONS:
Adapter body is FR-4 with 1 ounce minimum Copper traces.
Pads are bare Copper protected with Entek
by Enthone or
immersion white tin to eliminate coplanarity concerns and
solder bridges associated with hot air solder leveling.
Pins are Brass Alloy 360 1/2 hard per UNS C36000
ASTM-B16-85.
Pin plating is 200
[5.08m] min. Tin Per MIL-T-10727 Type
1 or Tin/Lead 90/10 MIL-P-81728 over 100
[2.54m] Nickel
per QQ-N-290.
Operating temperature=221°F [105°C].
MOUNTING CONSIDERATIONS:
Suggested PCB hole size=.028 ± .003 [.71 ± .08] dia.
Will plug into standard PGA sockets.
ORDERING INFORMATION
Tolerances:
Row-to-row:
± .003 [± .08]
Pin-to-pin:
± .003 [± .08] non-cumulative
All others:
± .005 [.13] unless otherwise specified
Specify Part No. 96-144M65
-or-
96-144M65-P for panelized form
when ordering
X-RAY VIEW TOP SIDE
QFP PAD ASSIGNMENT
TOP (QFP) SIDE
ALL DIMENSIONS: INCHES [MILLIMETERS]
Specify Part Number 144-PGM15048-30
for wire wrap PGA socket
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18035
REV. F
NORTH AMERICA
Frenchtown, NJ USA
TEL: (908) 996-6841
FAX:(908) 996-3891
EUROPE
TEL: +44 870 240 0249
FAX: +44 871 919 6033
europe@arieselec.com
http://www.arieselec.com info@arieselec.com
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參數描述
144-PLM12001-12 功能描述:IC 與器件插座 144 PIN PGA GOLD RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
144-PLM15025-12 功能描述:IC 與器件插座 144 PIN PGA GOLD RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
144-PLM15026-12 功能描述:IC 與器件插座 144 PIN PGA GOLD RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
144-PLM15026-16 功能描述:IC 與器件插座 144 PIN PGA NICKEL RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
144-PLS12001-12 功能描述:IC 與器件插座 144 PIN PGA GOLD RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
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