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參數(shù)資料
| 型號： | 156BO |
| 英文描述： | Surface Mount Chip LEDs |
| 中文描述： | 表面貼裝芯片LED |
| 文件頁數(shù)： | 1/3頁 |
| 文件大小： | 45K |
| 代理商： | 156BO |
Surface Mount Bi-Color Chip LEDs
MSL-156X SERIES
Description
Package Dimensions
The MSL-156xx , a series of bi-color Chip LED device ,
is designed in an industry standard package suitable for
SMT assembly method . This series contain different
combinations of Red & Green chips to provide broad
range choices in wavelength and intensity . They are
all molded in white diffused epoxy package.
Features
l
Small Size
l
Industry Standard Footprint
l
Compatible with IR Solder process
l
Availalble in 8 mm Tape on 7"(178mm)
Diameter Reels
l
Dual color
Applications
l
Push-button backlighting
l
LCD backlighting
l
Symbol backlighting
l
Front panel indicator
Absolute Maximum Ratings
@ TA=25
oC
Parameter
Symbol
Units
Peak Forward Current
IFP
mA
DC Forward Current
(1)
IF
mA
Power Dissipation
PD
mW
Reverse Voltage ( IR = 100 A )
VR
V
Operating Temperature Range
TOPR
oC
Storage Temperature Range
TSTG
oC
Notes:
1. Derate linearly as shown in figure 4 for temperatures above 25
oC
12/11/2000
25
80
Maximum Rating
-30 to + 100
5
-20 to + 80
65
Unity Opto Technology Co., Ltd.
A
B
NOTE:
1. All dimensions are in millimeter (inches)
2. Tolerance is ± 0.1mm (.004") unless otherwise specified.
0.5
(.02)
LED die
A (Short wavelength)
0.50
(.020)
PCB
2.0
(0.079)
0.6
(0.024)
+
0.90
(0.036)
0.9
(0.035)
(0.36)
Soldering Terminal
+
3.2
(.126)
+
LED die
B (Long wavelength)
1.4
(0.055)
Cathode mark
Polarity
1.6
(0.063)
2.20
(0.087)
2.7
(.106)
0.60
(.024)
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