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參數資料
| 型號： | 1674240-2 |
| 元件分類： | 插座 |
| 英文描述： | PGA563, IC SOCKET |
| 文件頁數： | 1/1頁 |
| 文件大?。?/td> | 117K |
| 代理商： | 1674240-2 |
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1674240-2 Product Details
Product View
1674240-2
T E I nternal N umber: 1 6 7 4 2 4 0 -2
PGA Sockets
Product Highlights:
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Zero Insertion Force
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Number of Positions = 563
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PCB Mount Style = Surface Mount
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Grid Size = 24x24
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Grid Spacing = 1.27 x 1.27 mm
Quick Links
Documentation & Additional Information
Product Drawings:
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SOCKET 563 (PDF, Japanese)
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SOCKET 563 WITH COVER TAPE (PDF, Japanese)
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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None Available
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
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None Available
Additional Information:
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Related Products:
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Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
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Insertion Force = Zero
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Number of Positions = 563
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PCB Mount Style = Surface Mount
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Grid Size = 24x24
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Grid Spacing (mm [in]) = 1.27 x 1.27 [.050 x .050]
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Chip Compatibility = AMD Athlon Mobile
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Frame Style = Open
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Heat Sink Attachment = Without
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ZIF Actuator = Screwdriver/Cam
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Profile = Low
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Cover Material = High Temperature Thermoplastic
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Leg Style = Ball Grid Array (BGA)
Termination Related Features:
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Socket Identifier = Socket 563
Body Related Features:
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Assembly Process Feature = Pick and Place Cover, Tape
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Cover Color = Black
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Socket Overall Height (mm [in]) = 2.8 [0.11]
Contact Related Features:
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Contact Style = Stamped + Formed
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Contact Base Material = Copper Alloy
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Contact Mating Area Plating Material = Gold (15)
Housing Related Features:
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Housing Color = Black
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Housing Material = High Temperature Thermoplastic
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Housing Flammability Rating = UL 94V-0
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Housing Material Temperature = High
Industry Standards:
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RoHS/ELV Compliance = ELV compliant, 5 of 6 Compliant
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Lead Free Solder Processes = Reflow solder capable to 245?C
Operation/Application:
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Application = Production
Packaging Related Features:
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Packaging Method = JEDEC Hard Tray
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Packaging Quantity = 600 sockets/box
Other:
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Brand = AMP
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