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參數(shù)資料
型號: 1812J1000823MXTE03
廠商: SYFER TECHNOLOGY LTD
元件分類: 數(shù)據(jù)傳輸濾波器
英文描述: 2 FUNCTIONS, 100 V, FEED THROUGH CAPACITOR
封裝: EIA STD PACKAGE SIZE 1812
文件頁數(shù): 1/4頁
文件大小: 177K
代理商: 1812J1000823MXTE03
X2Y
The Syfer Balanced Line Chip is a 3 terminal EMI chip device. The
revolutionary design provides simultaneous line-to-line and line-to-
ground filtering, using a single ceramic chip. In this way, differential
and common mode filtering are provided in one device. Capable of
replacing 2 or more conventional devices, it is ideal for balanced lines,
twisted pairs and dc motors, in automotive, audio, sensor and other
applications.
These filters can prove invaluable in meeting stringent EMC demands
particularly in automotive applications.
Specifications
W
T
L2
L
L1
Chip
Size
L
W
T
L1
L2
0603*
1.6±0.2 (0.063±0.008)
0.8±0.2 (0.03±0.008)
0.5±0.15 (0.02±0.006)
0.3±0.2 (0.012±0.008)
0.2±0.1 (0.008±0.004)
0805
2.0±0.3 (0.08±0.012)
1.25±0.2 (0.05±0.008)
1.0±0.15 (0.04±0.006)
0.5±0.25 (0.02±0.01)
0.3±0.15 (0.012±0.006)
1206
3.2±0.3 (0.126±0.012)
1.60±0.2 (0.063±0.008)
1.1±0.2 (0.043±0.008)
0.95±0.3 (0.037±0.012)
0.5±0.25 (0.02±0.01)
1410
3.6±0.3 (0.14±0.012)
2.5±0.3 (0.1±0.012)
2 max. (0.08 max.)
1.20±0.3 (0.047±0.012)
0.5±0.25 (0.02±0.01)
1812
4.5±0.35 (0.18±0.014)
3.2±0.3 (0.126±0.012)
2 max. (0.08 max.)
1.5±0.35 (0.06±0.014)
0.5±0.25 (0.02±0.01)
2220
5.7±0.4 (0.22±0.016)
5.0±0.4 (0.2±0.016)
2.5 max. (0.1 max.)
2.25±0.4 (0.09±0.016)
0.75±0.25 (0.03±0.01)
Dielectric
X7R or C0G/NP0
Electrical Configuration
Multiple capacitance
Capacitance Measurement
At 1000hr point
Typical Capacitance Matching
Better than 5%
Temperature Rating
-55°C to 125°C
Dielectric Withstand Volage
2.5 x Rated Volts for 5 secs.
Charging current limited to 50mA Max.
Insulation Resistance
100Gohms or 1000s (whichever is the less)
Termination Material
100% matte tin over nickel
Advantages
Replaces 2 or 3 capacitors with one device
Matched capacitance line to ground on both lines
Low inductance due to cancellation effect
Capacitance line to line
Differential and common mode attenuation
Effects of temperature and voltage variation eliminated
Effect of ageing equal on both lines
High current capability
Applications
Balanced lines
Twisted pairs
EMI Suppression on DC motors
Sensor/transducer applications
Wireless communications
Audio
GROUND
AA
BB
C1
C2
INPUT 1
INPUT 2
A
B
D
C
Recommended Solder Lands
220nF
100nF
47nF
22nF
10nF
4.7nF
2.2nF
1nF
470pF
220pF
100pF
47pF
22pF
0
20
40
60
80
0.1
1
10
100
1000
Insertion Loss Characteristics (common mode)
Typical 50 ohm system
Insertion
Loss
(dB)
Frequency (MHz)
Dimensions mm (inches)
Chip Size
A
B
C
D
0603* 0.6 (0.024) 0.6 (0.024) 0.4 (0.016) 0.2 (0.008)
0805
0.95 (0.037) 0.9 (0.035) 0.3 (0.012) 0.4 (0.016)
1206
1.2 (0.047) 0.9 (0.035) 0.6 (0.024)
0.8 (0.03)
1410
2.05 (0.08) 1.0 (0.04)
0.7 (0.028) 0.9 (0.035)
1812
2.65 (0.104) 1.4 (0.055)
0.8 (0.03)
1.4 (0.055)
2220
4.15 (0.163) 1.4 (0.055) 1.2 (0.047) 1.8 (0.071)
Integrated Passive Components
Balanced Line EMI Chip
notes
* The 0603 chip size is a development item. All technical information should
be considered provisional and subject to change. Refer to Sales office.
FILTSMX2Y.ver2
相關(guān)PDF資料
PDF描述
0603R-391G 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
0603R-331J 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
0603R-331G 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
0603R-9N5K 1 ELEMENT, 0.0095 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
0603R-8N7K 1 ELEMENT, 0.0087 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
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