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參數資料
| 型號： | 1827496-2 |
| 元件分類： | 插座 |
| 英文描述： | PGA939, IC SOCKET |
| 文件頁數： | 1/1頁 |
| 文件大小： | 120K |
| 代理商： | 1827496-2 |
1827496-2 Product Details
1827496-2
T E I nternal N umber: 1 8 2 7 4 9 6 -2
PGA Sockets
Product Highlights:
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Zero Insertion Force
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939 Positions
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PCB Mount Style = Surface Mount
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Grid Size = 31x31
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Grid Spacing = 1.27 x 1.27 mm
Quick Links
Documentation & Additional Information
Product Drawings:
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None Available
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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Product specification, Socket 939 (TIF, English)
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
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None Available
Additional Information:
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Related Products:
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Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
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Insertion Force = Zero
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Number of Positions = 939
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PCB Mount Style = Surface Mount
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Grid Size = 31x31
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Grid Spacing (mm [in]) = 1.27 x 1.27 [.050 x .050]
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Chip Compatibility = AMD Athlon, AMD Athlon 64 FX
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Frame Style = Closed
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Heat Sink Attachment = Without
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ZIF Actuator = Single Lever
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Profile = Low
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Leg Style = Ball Grid Array (BGA)
Termination Related Features:
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Socket Identifier = Socket 939
Body Related Features:
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Assembly Process Feature = Pick and Place Cover, Tape
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Actuator Handle Material = Stainless steel
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Socket Overall Height (mm [in]) = 6.3 [0.248]
Contact Related Features:
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Contact Style = Stamped + Formed
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Contact Base Material = Copper Alloy
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Contact Plating, Mating Area, Material = Gold Flash
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Handle Type = Low Profile
Housing Related Features:
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Housing Color = Black
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Housing Material = Thermoplastic - GF
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Housing Flammability Rating = UL 94V-0
Industry Standards:
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RoHS/ELV Compliance = ELV compliant, 5 of 6 Compliant
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Lead Free Solder Processes = Reflow solder capable to 245?C
Operation/Application:
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Application = Production
Packaging Related Features:
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Packaging Method = JEDEC Hard Tray
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Packaging Quantity = 10/Tray
Other:
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Brand = AMP
Corporate Information
Quick Links
Customer Support
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