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參數(shù)資料
| 型號(hào)： | 1FRH360-762GGCS |
| 廠商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分類： | 插座 |
| 英文描述： | BGA360, IC SOCKET |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大小： | 433K |
| 代理商： | 1FRH360-762GGCS |
Description: Socket (FRH, 1.00mm pitch)
Guide Box Mat’l: High Temp. Liquid Crystal
Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Base Mat’l: FR-4 Glass Filled Epoxy
Index: -40°C to 140°C (-40°F to 284°F)
Socket Size:
3.00mm wider and
10.00mm longer than
BGA device (for
packages larger than
15.00mm square).*
Flip-Top
TM BGA Sockets
1.27mm and 1.00mm Pitch
Flip-Top
TM
BGA Sockets
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16A
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
SMT models are shipped un-assembled to ease
solderability. Thru-hole models are shipped fully
assembled.
1. Lower assembly is soldered to PC board with no
external hold-down mechanism. Thru-hole models may
be soldered to PC board or plugged into a mating
socket.
2. Upper assembly inserts easily to lower assembly by
aligning guide posts and installing four (supplied)
screws.
3. Finned heat sink or coin screw is screwed down to flush
with bottom of lid.
4. Lid opens easily by pressing latch.
5. BGA device is inserted by aligning A1 position with
chamfered corner of Flip-Top socket. Place support
plate on top of device, close lid, engage heat sink or
coin screw, and socket is ready for use.
Detailed Installation and General Usage Instructions are
provided with product.
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Plating:
G - Gold over Nickel
Terminal Support:
Polyimide Film
Spring Material:
Stainless Steel
Lid, Latch, Heat Sink/Coin Screw
and Support Plate Material:
Aluminum
Solder Ball:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Features:
Designed to save space on new
and existing PC boards in test,
development, programming and
production applications.
No external hold-downs or
soldering of BGA device required.
AIC exclusive solder ball terminals
offer superior processing.
Uses same footprint as BGA device.
Available with integral, finned heat
sink or coin screw clamp
assembly.
Table of Models
Description: Socket (FRG, 1.27mm pitch)
Guide Box and Base Mat’l: High Temp. Liquid
Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Socket Size:
3.00mm wider and
10.00mm longer than
BGA device (for
packages larger than
15.00mm square).*
How It Works
Footprint Dash #
If Applicable*
1 FR G XXXX - 821 G G XX
Contact Plating
Terminal Plating
Terminal Type
Model Type
RoHS Compliant Insulator:
FR - Flip-Top BGA Socket
Number of Positions
See options
RoHS Compliant:
G - Gold
RoHS Compliant:
G - Gold
Pitch
G = .050/(1.27mm)
H = .039/(1.00mm)
*See footprints section or
online database.
Clamp Options
HS - Heat Sink (3 Fins Std.)
CS - Coin Screw
FRG replaces FTG.
* For device packages smaller than 15.00mm square, the socket size is X = .709/(18.00)
and Y = .984/(25.00).
Chip support plate
(supplied)
BGA or LGA
device
Upper
assembly
Lower
assembly
See page 15 for Generic
Reflow Profiles.
How To Order
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