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參數(shù)資料
型號: 1KIS200-50GG
廠商: ADVANCED INTERCONNECTIONS CORP
元件分類: 插座
英文描述: PGA200, IC SOCKET
封裝: ROHS COMPLIANT
文件頁數(shù): 1/2頁
文件大小: 264K
代理商: 1KIS200-50GG
PGA Sockets
Low Insertion Force PGA Sockets
.100” (2.54mm) Standard Grid
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
8
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Footprint Dash #
If Applicable
*
1 RIS
068 - 04 M G
Contact Plating
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
KIS - Peel-A-Way
FIS - FR-4
RIS - New Hi-Temp Molded
Number of Pins
004 to 484
*Footprints available online or
in separate booklet.
See options on next page
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
RoHS Compliant:
G - Gold
T - Tin/Lead
Footprint Dash #
If Applicable
*
1 ESX 503 - 234
M
G
Contact Plating
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
KSX - Peel-A-Way
ESX - New Hi-Temp Molded
CSX - Hi-Temp Molded s
Number of Pins
004 to 2209
*Footprints available online or
in separate booklet.
See options
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead s
RoHS Compliant:
G - Gold
T - Tin/Lead s
s
= Not RoHS Compliant
RIS replaces HCIS, HCS, CIS, and CS.
Description: FR-4 (FIS)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Description: Peel-A-Way (KIS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
Description: Molded (RIS)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
8
Table of Models
Options
How To Order
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
?
.062
(1.57)
PC Board
?
.100
(2.54)
PC Board
Features:
Low insertion force (1 oz. average
per pin)
Screw-machined terminals with
multiple finger contacts for
reliability
Closed bottom terminal for 100%
anti-wicking of solder
Tapered entry for ease of insertion
Custom designs available
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per MIL-G-45204
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Tape Sealant - add 3M to end of part number
Removable tape seal protects plated contact in harsh environments
Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
Spray flux without contaminating contact area
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
Polyimide
Film
.005
(.13)
相關PDF資料
PDF描述
1KIS200-50TT PGA200, IC SOCKET
1KIS200-33MG PGA200, IC SOCKET
1KIS200-210GG PGA200, IC SOCKET
1KIS200-04MG PGA200, IC SOCKET
1KIS200-210MG PGA200, IC SOCKET
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