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參數資料
| 型號： | 1KIS215-176MG |
| 廠商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分類： | 插座 |
| 英文描述： | PGA215, IC SOCKET |
| 文件頁數： | 1/2頁 |
| 文件大?。?/td> | 174K |
| 代理商： | 1KIS215-176MG |
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 Fax 401-823-8723 Email info@advintcorp.com Internet http://www.advintcorp.com
Polyimide Film
.005
(.13)
RTV Sealed
Tape Sealed
RTV
Seal
To order: Add 3M to end of part #
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Low Insertion Force
Peel-A-Way
PGA Sockets
Features
:
Disposable carriers peel away after
soldering.
Peel-A-Way tabs and full grid wafer
supplied on all Peel-A-Way PGA sockets.
Maximum air flow under PGA for greater
cooling.
Better flux rinse and cleaning.
Allows inspection of solder joints on both
sides of PCB.
Lowest profile with use of type -210
terminal.
Peel-A-Way disposable socket terminal
carrier available in any configuration shown
or custom designed to meet your
specifications.
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
Solder Preform:
63% Tin, 37% Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Body Material:
KS/KIS - Polyimide Film
-269C to 400C (-452F to 752F)
Peel-A-Way
Low Insertion Force PGA Sockets
How To Order
1
KS
068
-85
T
G
Footprint Dash #
If Applicable*
Terminal Plating
G - Gold
T - Tin-Lead
Contact Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Body Type
KS - 2.5 oz.(70.85 g) avg. insertion force
KIS - 1 oz.(28.34 g) avg. insertion force
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Polyimide Film
Peel away
after soldering
to PCB.
PCB
Solder fillets visible both sides
for inspection and cleaning.
Sealant Options
Peel-A-Way covered by patent rights issued and/or pending.
How To Use:
1. Place socket in PCB.
2. Send PCB and socket through soldering operation.
3. Peel away polyimide film carrier.
inch/(mm
)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 34
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