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參數資料
| 型號： | 1N4626D2B-JQRS.SEM |
| 廠商： | SEMELAB LTD |
| 元件分類： | 齊納二極管 |
| 英文描述： | 5.6 V, 0.4 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE |
| 封裝： | HERMETIC SEALED, CERAMIC, DLCC2 VARIANT B, 2 PIN |
| 文件頁數： | 1/3頁 |
| 文件大小： | 360K |
| 代理商： | 1N4626D2B-JQRS.SEM |
LOW NOISE
ZENER DIODE
Semelab Limited reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing orders.
Semelab plc
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Document Number 9257
Telephone +44 (0) 1455 556565
Fax +44 (0) 1455 552612
Issue 1
Email: sales@semelab-tt.com
Website: http://www.semelab-tt.com
Page 1 of 3
1N4626D2A / 1N4626D2B
VZ = 5.6V
±5% Tolerance
Low Leakage
Low Current
Low Noise
Hermetic Ceramic Surface Mount Package Designed
as a Drop In Replacement for “D-5A” / “B-MELF” Package
Space Level and High-Reliability Screening Options Available
ABSOLUTE MAXIMUM RATINGS
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise stated)
PT (1)
Total Power Dissipation at
TA = 55°C
400mW
Derate above 55°C
33mW/°C
IZM (1)
Zener Current
65mA
IZSM
Zener Surge Current
700mA
TJ
Junction Temperature Range
-65 to +175°C
TSTG
Storage Temperature Range
-65 to +175°C
TSP
Maximum Soldering Pad Temperature for 20s
260°C
ELECTRICAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise stated)
Symbols
Parameters
Test Conditions
Min
Typ
Max
Units
VZ
Zener Voltage
IZT = 250A
5.32
5.6
5.88
VF
Forward Voltage
IF = 200mA
1.1
V
ZZT
Maximum Zener Impedance
IZT = 250A
1400
VR = 4V
5
IR
Reverse Current
TA = 150°C
10
A
ND
Noise Density
IZT = 250A
4
Hz
V
VZ
Temperature Coefficient
of Zener Voltage
IZT = 250A
T1 = 25°C T2 = 125°C
-0.02
+0.04
%/°C
THERMAL PROPERTIES
Symbols
Parameters
Max.
Units
RθJSP(IN)
Thermal Resistance, Junction To Solder Pads. TSP = 25°C
100
°C/W
RθJA(PCB)
Thermal Resistance, Junction To Ambient
(1)
300
°C/W
Note
Notessss
(1)
PCB = FR4 – 0.0625 Inch (1.59mm), 1 Layer, 1.0-Oz Cu, 0.006 Inch
2 (1.55mm x 2.67mm2) Pad Size, horizontal, in still air.
Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| 1N4626DUR | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:GLASS SURFACE MOUNT 0.5 WATT ZENERS |
| 1N4626DUR-1 | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:GLASS SURFACE MOUNT 0.5 WATT ZENERS |
| 1N4626DURTR | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:GLASS SURFACE MOUNT 0.5 WATT ZENERS |
| 1N4626DURTR-1 | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:GLASS SURFACE MOUNT 0.5 WATT ZENERS |
| 1N4626-TR | 功能描述:穩壓二極管 .25W 5% Lw Noise/Lvl RoHS:否 制造商:Vishay Semiconductors 齊納電壓:12 V 電壓容差:5 % 電壓溫度系數:0.075 % / K 齊納電流: 功率耗散:3 W 最大反向漏泄電流:3 uA 最大齊納阻抗:7 Ohms 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AC 封裝:Reel |
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