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參數(shù)資料
| 型號： | 1N6626D3B-JQRS.GCDM |
| 廠商： | SEMELAB LTD |
| 元件分類： | 整流器 |
| 英文描述： | 1.75 A, 200 V, SILICON, RECTIFIER DIODE |
| 封裝： | CERAMIC, DLCC3 VARIANT B, 2 PIN |
| 文件頁數(shù)： | 1/4頁 |
| 文件大小： | 276K |
| 代理商： | 1N6626D3B-JQRS.GCDM |
ULTRA FAST RECOVERY
POWER RECTIFIER
Semelab ltd reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab
Semelab ltd
ltd
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Document Number 8975
Telephone +44 (0) 1455 556565
Fax +44 (0) 1455 552612
Issue 2
Email: sales@semelab-tt.com
Website: http://www.semelab-tt.com
Page 1 of 4
1N6626D3A / 1N6626D3B
High Reliability Screening Options Available
High forward current surge current capability
Switching power supplies or other applications requiring
fast switching and low forward loss
ABSOLUTE MAXIMUM RATINGS (T
A = 25°C unless otherwise stated)
VRWM
Working Peak Reverse Voltage
200V
IO
1
Average Rectified Forward Current TA = 25°C
1.75A
IFSM2
Peak Forward Current Surge
75A
TJ
Junction Temperature Range
-65 to +175°C
Tstg
Storage Temperature Range
-65 to +175°C
TSP
Maximum Soldering Pad Temperature for 20s
260°C
THERMAL PROPERTIES
Symbols
Parameters
Max.
Units
RθJSP(IN)
Thermal Resistance, Junction To Solder Pads TSP = 25°C
40
°C/W
RθJA(PCB)(3)
Thermal Resistance, Junction To Ambient, On PCB
72.5
°C/W
RθJA(PCB)(4)
Thermal Resistance, Junction To Ambient, On PCB
110
°C/W
Notes
(1) IO1 is rated at 1.75A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to RθJA(PCB) ≤ 85°C/W.
(2) TA = 25°C @ IO=0A and VRWM = 0V for ten 8.3mS surges at 1 minute intervals.
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (645mm x 645mm) , horizontal in still air.
(4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”), (1.78mm x 3.94mm) , horizontal in still air.
IO1 is rated at 1.5A @ TA = 25°C for PC boards where RθJA(PCB) ≤ 111°C/W. Derate at 10mA/°C above TA = 25°C in this case.
Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.
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