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參數(shù)資料
| 型號： | 1RSX503-311GG |
| 廠商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分類： | 插座 |
| 英文描述： | PGA503, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 220K |
| 代理商： | 1RSX503-311GG |
PGA Sockets
Low Insertion Force PGA Sockets
.100” (2.54mm) Staggered (Interstitial) Grid
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
10
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
10
Footprint Dash #
If Applicable
*
1 RSX 503 - 234
M
G
Contact Plating
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
KSX - Peel-A-Way
RSX - New Hi-Temp Molded
Number of Pins
004 to 2209
*Footprints available online or
in separate booklet.
See options on next page
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
RoHS Compliant:
G - Gold
T - Tin/Lead
Table of Models
Options
How To Order
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
Features:
Low insertion force (1 oz. average
per pin)
Screw-machined terminals with
multiple finger contacts for
reliability
Closed bottom terminal for 100%
anti-wicking of solder
Tapered entry for ease of insertion
Custom designs available
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per MIL-G-45204
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Tape Sealant - add 3M to end of part number
Removable tape seal protects plated contact in harsh environments
Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
Spray flux without contaminating contact area
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
Description: Peel-A-Way (KSX)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
Description: Molded (RSX)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.100
(2.54)
Molded
Body
Type -235
Shown
.005 Typ.
(.13)
Type -210
Shown
RSX replaces CSX.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 1RSX503-311MG | PGA503, IC SOCKET |
| 1RSX503-311TT | PGA503, IC SOCKET |
| 1RSX503-313GG | PGA503, IC SOCKET |
| 1RSX503-313MG | PGA503, IC SOCKET |
| 1RSX503-313TG | PGA503, IC SOCKET |
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