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參數資料
型號: 24C16B
廠商: Microchip Technology Inc.
英文描述: 16K 5.0V E-Temperature serial EEPROMs(16K位,5.0V,1M次擦寫周期,硬件寫保護,施密特觸發輸入的EEPROM)
中文描述: 16K的5.0V電子溫度(16K的位和5.0V,100萬次擦寫周期,硬件寫保護,施密特觸發輸入的EEPROM的串行EEPROM)
文件頁數: 1/10頁
文件大小: 111K
代理商: 24C16B
1995 Microchip Technology Inc.
DS21081C-page 1
FEATURES
Single supply with operation from 4.5-5.5V
Low power CMOS technology
- 1 mA active current typical
- 10
μ
A standby current typical at 5.5V
Organized as 4 or 8 blocks of 256 bytes
(4 x 256 x 8) or (8 x 256 x 8)
Two wire serial interface bus, I
Schmitt trigger, filtered inputs for noise suppres-
sion
Output slope control to eliminate ground bounce
100 kHz compatibility
Self-timed write cycle (including auto-erase)
Page-write buffer for up to 16 bytes
2 ms typical write cycle time for page-write
Hardware write protect for entire memory
Can be operated as a serial ROM
Factory programming (QTP) available
ESD protection > 4,000V
1,000,000 ERASE/WRITE cycles guaranteed
Data retention > 200 years
8 pin DIP, 8-lead or 14-lead SOIC packages
Available for extended temperature range
- Automotive: -40C to +125C
2
C
compatible
DESCRIPTION
The Microchip Technology Inc. 24C08B/16B is an 8K/
16K bit Electrically Erasable PROM intended for use in
extended/automotive temperature ranges. The device
is organized as 4 or 8 blocks of 256 x 8 bit memory with
a two wire serial interface. The 24C08B/16B also has
a page-write capability for up to 16 bytes of data. The
24C08B/16B is available in the standard 8-pin DIP and
both 8-lead and 14-lead surface mount SOIC pack-
ages.
PACKAGE TYPE
BLOCK DIAGRAM
1
2
3
4
8
7
6
5
V
WP
SCL
SDA
CC
A0
A1
A2
V
SS
DIP
8-lead
SOIC
1
2
3
4
8
7
6
5
A0
A1
A2
V
V
WP
SCL
SDA
CC
NC
SS
CC
A0
A1
NC
A2
NC
V
1
2
3
4
5
6
7
14
13
12
NC
SCL
SDA
NC
9
8
11
10
WP
V
NC
14-lead
SOIC
24C08B/16B
24C08B/16B
24C08B/16B
HV GENERATOR
EEPROM ARRAY
PAGE LATCHES
YDEC
XDEC
SENSE AMP
R/W CONTROL
MEMORY
CONTROL
LOGIC
I/O
CONTROL
LOGIC
WP
SDA
SCL
V
CC
V
SS
24C08B/16B
8K/16K 5.0V E-Temperature Serial EEPROMs
I
2
C is a trademark of Phillips Corporation.
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