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參數(shù)資料
| 型號(hào)： | 256994 |
| 英文描述： | SYMBOLS ON ROLL.EXTR.FLAMM |
| 中文描述： | 標(biāo)志上ROLL.EXTR.FLAMM |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 369K |
| 代理商： | 256994 |
BallLock
BGA Socket
Note: Aries specializes in custom design and production. In addition to the
standard products shown on this page, special materials, platings, sizes, and
configurations can be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
FEATURES:
Any grid size available on either 1.27mm [.050”] or 1.50mm [.059”]
pitch.
Lidless design - ball locks into two-fingered contact.
Ultra-low profile socket adds only .050 [1.27] to overall package height
(.100 [2.54] with SnapAdapt pins).
Optional Corner guides aid in package insertion (not used with
SnapAdapt pins).
Consult Data Sheet Nos. 23003 and 23004 for Aries BallNest
Socket.
SPECIFICATIONS:
Socket body is UL 94V-0 FR-4.
Optional lead-in guides are black UL 94V-0 glass-filled Thermoplastic
(PPS).
Contacts are Beryllium Copper Alloy per QQ-C-533.
Contact plating is either 100
μ
[2.54
μ
m] min. 90/10 Tin/Lead per MIL-T-
10727 or 10
μ
[.25
μ
m] min. Gold per MIL-G-45204 over 30
μ
[.76
μ
m]
Nickel per QQ-N-290.
Solder ball terminations are 90/10 Lead/Tin.
Solder paste is 63/37 eutectic.
Solder mask is “dryfilm.”
Inductance
≤
1
η
H/cont. @ 100MHz approx. (under testing).
Capacitance
≤
1pf/contact @ 100MHz approx. (under testing).
Contact resistance=10mOhms initial, 20mOhms @10 cycles
(under testing).
Durability=10 cycles max.; up to 50 cycles with SnapAdapt
TM
pin.
Insertion Force=50 grams/contact avg. (approximate);
40 grams/contact initial when used with SnapAdapt
TM
pin.
Withdrawal Force=20 grams/contact max. (approximate).
Socket accepts BGA devices with .030 [.76] dia. balls.
MOUNTING CONSIDERATIONS:
Suggested PCB pad size=.025±.003 [.64±.08] dia.
A
LL DIMENSIONS
:
INCHES
[
MILLIMETERS
]
ORDERING INFORMATION
(for socket w/out corner guides only)
BallLock CONTACT
BGA Package w/ .030 [.76] dia.
solder balls
“A”=BGA PACKAGE SIZE + .085 [2.29]
“B”=(NO. OF POSITIONS PER ROW - 1) X BGA PITCH
“C”=BGA PACKAGE SIZE + .015 [.25]
“D”=BGA PACKAGE SIZE + .060 [1.52]
Optional
corner
guides
Note: Part number assigned by
factory when ordering
socket with corner guides.
BGA Package with SMT
SnapAdapt pins in lieu of solder
balls. Consult Data Sheet No.
23012 and 23013 for details.
XXX-BGXXXXX-7XX
No. of positions
(256 shown)
Ball Grid Array
Footprint designator
(assigned by factory)
Plating:
0=Tin
1=Gold
Pitch
U=1.50mm
V=1.27mm
Contact Type:
7=BallLock surface mount
solder ball contact
Use Aries’ BGA
Order Sheet, Data
Sheet No. 23000, for
prompt quotations.
Corner guides not used
with SnapAdapt pins.
All tolerances ± .005 [.13]
unless otherwise specified
Covered by patents and/or patents applied for.
NORTH AMERICA
Frenchtown, NJ USA
TEL: (908) 996-6841
FAX: (908) 996-3891
UK/IRELAND/GB
TEL: +44 870 240 0249
FAX: +44 1653 600493
uking@arieselec.com
EUROPE/MAINLAND/HOLLAND
TEL: +31 78 615 94 65
FAX: +31 78 615 43 11
europe@arieselec.com
http://www.arieselec.com info@arieselec.com
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
23002
REV.E
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