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參數資料
| 型號： | 28F016SC |
| 英文描述： | Evaluation Kit/Evaluation System for the MAX5954L/MAX5954A |
| 中文描述： | 28F016SC -字節寬SmartVoltage FlashFile Memory系列4。 8。及16兆比特 |
| 文件頁數： | 1/59頁 |
| 文件大小： | 384K |
| 代理商： | 28F016SC |
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E
PRODUCT PREVIEW
May 1998
Order Number: 290645-001
n
Flexible SmartVoltage Technology
2.7 V
–3.6 V Read/Program/Erase
2.7 V or 1.65 V I/O Option Reduces
Overall System Power
12 V for Fast Production
Programming
n
High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
n
Optimized Architecture for Code Plus
Data Storage
Eight 8-Kbyte Blocks,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks
Fast Program Suspend Capability
Fast Erase Suspend Capability
n
Flexible Block Locking
Lock/Unlock Any Block
Full Protection on Power-Up
WP# Pin for Hardware Block
Protection
V
PP
=
GND Option
V
CC
Lockout Voltage
n
Low Power Consumption
9 mA Typical Read Power
10 μA Typical Standby Power with
Automatic Power Savings Feature
n
Extended Temperature Operation
–40 °C to +85 °C
n
Easy-12 V
Faster Production Programming
No Additional System Logic
n
128-bit Protection Register
64-bit Unique Device Identifier
64-bit User Programmable OTP
Cells
n
Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles
n
Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., voice)
n
Automated Word/Byte Program and
Block Erase
Command User Interface
Status Registers
n
SRAM-Compatible Write Interface
n
Cross-Compatible Command Support
Intel Basic Command Set
Common Flash Interface
n
x 16 for High Performance
48-Ball
μ
BGA* Package
48-Lead TSOP Package
n
x 8 I/O for Space Savings
48-Ball
μ
BGA* Package
40-Lead TSOP Package
n
0.25
μ
ETOX VI Flash Technology
The 0.25 μm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 μ technology, represents a
feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage
capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking
allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data
Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on
the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP,
and 48-ball μBGA* packages. Additional information on this product family can be obtained by accessing
Intel’s WWW page: http://www.intel.com/design/flcomp.
3 VOLT ADVANCED+ BOOT BLOCK
8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F008C3, 28F016C3, 28F032C3
28F800C3, 28F160C3, 28F320C3
相關PDF資料 |
PDF描述 |
|---|---|
| 28F032C3 | 3 VOLT ADVANCED+ BOOT BLOCK. 8-. 16-. 32-MBIT FLASH MEMORY FAMILY |
| 28F160F3 | 5V/3.3V or Adjustable, Low-Dropout, Low-IQ, 500mA Linear Regulators |
| 28F800F3 | 3 Volt Fast Boot Block Flash Memory(3 V 8M位快速引導塊閃速存儲器) |
| 28F160F3 | 16MBIT Fast Boot Block Flash Memory(16兆位的快速引導塊閃速存儲器) |
| 28F2001BX-T | 5V/3.3V or Adjustable, Low-Dropout, Low-IQ, 500mA Linear Regulators |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 28F016SV | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:16-MBIT (1 MBIT x 16, 2 MBIT x 8) FlashFile MEMORY |
| 28F016XD | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:16-MBIT (1 MBIT x 16) DRAM-INTERFACE FLASH MEMORY |
| 28F016XS | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:16-MBIT (1 MBIT x 16, 2 MBIT x 8) SYNCHRONOUS FLASH MEMORY |
| 28F0181-1SR-10 | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 115ohms 100MHz 10A Broad Band Frequency RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| 28F020 | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:28F020 2048K (256K X 8) CMOS FLASH MEMORY |
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