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參數資料
型號: 2FHA360-823G
廠商: ADVANCED INTERCONNECTIONS CORP
元件分類: 插座
英文描述: BGA360, IC SOCKET
封裝: ROHS COMPLIANT
文件頁數: 1/2頁
文件大小: 761K
代理商: 2FHA360-823G
Ball Grid Array (BGA) Adapters
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
2
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
2
BGA Adapters
Table of Models
Description: Standard Adapter (A)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Note: Mates with Standard Socket (S)
Description: Extraction Slot Adapter (AX)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Note: Mates with Extraction Socket (SB)
How To Order
Footprint Dash #
If Applicable
1
F
H A XXX - 715 G
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
F - FR-4
Number of Positions
See options
RoHS Compliant:
G - Gold
Pitch
G = .050/(1.27mm)
H = .039/(1.00mm)
J = .0315/(0.80mm)
K = .0295/(0.75mm)
Model Type
A = Standard Adapter
AX = Extraction Slot Adapter
(1.27 and 1.00mm only)
See footprint section online
Features:
Soldering BGA Device to adapter
subjects BGA to less thermal
stress than soldering BGA directly
to a PCB due to the adapter’s
lower mass.
Uses same footprint as BGA
device.
Custom adapters available for
heat sink attachment.
Gold plated screw-machined
terminals for superior durability.
Unique SMT Adapter provides
reliable solution for mounting or
socketing LGA or re-worked BGA
devices.
SMT Adapters mate with our BGA
Sockets for LGA to BGA
conversion or SMT Board to
Board applications.
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Plating:
G - Gold over Nickel
Gold per MIL-G-45204
Nickel per QQ-N-290
Options
Extraction Tool
P/N 8125
Description: SMT Adapter (A or AX)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Note: For use with LGA or reworked BGA
devices
Insulator Size:
BGA device body
+.079/(2.00mm)
Insulator Size:
BGA device body
+.157/(4.00mm)
Insulator Size:
BGA device body
+.079/(2.00mm)[A]
+.157/(4.00mm)[AX]
Insert “T” bar end of tool into extraction slot adapter.
Slide tool to end of slot and pry adapter from socket.
Repeat in additional slots until adapter is separated from socket.
Works with LCP or FR-4 sockets.
Extraction
Tool
Socket
Adapter
BGA Device
Extraction
Slot
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