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參數資料
| 型號： | 2RGSB360-636GG |
| 廠商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分類： | 插座 |
| 英文描述： | BGA360, IC SOCKET |
| 文件頁數： | 1/2頁 |
| 文件大?。?/td> | 727K |
| 代理商： | 2RGSB360-636GG |
Ball Grid Array (BGA) Adapters
For use with BGA Sockets on pages 8-9
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16A
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
BGA Adapters
Table of Models
Description: Standard Adapter (A)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Note: Mates with Standard Socket (S)
Description: Extraction Slot Adapter (AX)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Note: Mates with Extraction Socket (SB)
How To Order
Footprint Dash #
If Applicable*
1
F
H A XXX - 715 G
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
F - FR-4
Number of Positions
See options - available with Standard,
male to male, or surface mount
terminal styles.
RoHS Compliant:
G - Gold
Pitch
G = .050/(1.27mm)
H = .039/(1.00mm)
J = .0315/(0.80mm)
Model Type
A = Standard Adapter
AX = Extraction Slot Adapter
(1.27 and 1.00mm only)
*See footprints section or
online database.
Note: See pages 4-5 for 0.50mm and 0.65mm pitch.
Consult factory for custom 0.75mm pitch designs.
For SMT Adapters, select Model Type A or AX
and appropriate SMT Terminal Type from page 7.
Features:
Soldering BGA Device to adapter
subjects BGA to less thermal
stress than soldering BGA directly
to a PCB due to the adapter’s
lower mass.
Uses same footprint as BGA
device.
Custom adapters available for
heat sink attachment.
Gold plated screw-machined
terminals for superior durability.
Unique SMT Adapter provides
reliable solution for mounting or
socketing LGA or re-worked BGA
devices.
SMT Adapters mate with our BGA
Sockets for LGA to BGA
conversion or SMT Board to
Board applications.
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Solder Ball:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
Gold per ASTM-B-488
Nickel per QQ-N-290
Options
Extraction Tool
P/N 8125
Insulator Size:
BGA device body
+.079/(2.00mm)
Insulator Size:
BGA device body
+.157/(4.00mm)
Insert “T” bar end of tool into extraction slot adapter.
Slide tool to end of slot and pry adapter from socket.
Repeat in additional slots until adapter is separated from socket.
Works with LCP or FR-4 sockets.
Extraction
Tool
Socket
Adapter
BGA Device
Extraction
Slot
Note: For use with LGA or reworked BGA devices, select surface mount (SMT) terminals which
feature solder balls on device side. SMT Adapter terminals may also be used for surface mount
board to board applications.
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