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| 型號： | 2XX-7243-00-1807 |
| 英文描述： | Low-Power, Single-/Dual-Level Battery Monitors with Hysteresis and Integrated µP Reset |
| 中文描述： | IC插座PQFP 100未來路 |
| 文件頁數(shù)： | 1/4頁 |
| 文件大小： | 112K |
| 代理商： | 2XX-7243-00-1807 |
3M Electronic Handling and Protection Division
6801 River Place Blvd.
Austin, TX 78726-9000
For
technical, sales or ordering information call
800-328-0411
or visit our website:
http://www.3M.com/ehpd
OEM
PQFP Sockets
TS-0361-10
Sheet
1 of 4
Date Issued: November 1, 1999
8.
Physical
Insulation
Material: Glass
Filled Polyethersulfone ( PES )
Flammability:
UL 94V
-0
Color: Black
Contact
Material:
Beryllium Copper
Plating
Underplate:
50
m
"
[ 1.27
m
m ] Nickel
W
iping Area & Solder T
ails:
200
m
"
[ 5.08
m
m ] 60/40 T
in Lead
Latching Aid
Material:
Polycarbonate (PC)
Color: Black
Marking:
Raised Letters:
3M Logo & Part Identification
Electrical
Curr
ent Rating:
1 A
Insulation Resistance:
> 1
￥
10
12
W
at 500 Vdc
W
ithstanding V
oltage:
1000 V
rms at Sea Level
Mechanical
Durablity:
25 acuations
Normal For
ce:
150 grams average per contact
Environmental
Temperatur
e Rating Operating:
0
°
C to +105
°
C
UL File No.: E68080
Accepts JEDEC MO-069 packages, lead
counts 84, 100 and 132
.025"(0.64mm) center line contacts for
high-density packaging
Lid design separates, maintains IC lead
spacing
Lid acts as package carrier and transport
protector
Lid is compatible with conventional package
shipping tubes and trays
Slotted, “open” socket walls and corners
permit airflow around capturedpackage (aids
in package heat dissipation)
Latches secure lid/package assembly to base
Mirror image contact pin-out available on
most lead counts
Required tooling available in two styles
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