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參數資料
| 型號： | 30SPA0557 |
| 元件分類： | 放大器 |
| 英文描述： | 27000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER |
| 封裝： | DIE-14 |
| 文件頁數： | 3/5頁 |
| 文件大小： | 401K |
| 代理商： | 30SPA0557 |
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RF In
RF Out
Vg3
Vg2
Vg1
Vd1
Vd2
Vd3
2.000
(0.079)
Pepoducion
1
2
3
4
5
6
7
8
9
10
11
12
13
0.818
(0.032)
1.218
(0.048)
1.618
(0.064)
2.418
(0.095)
3.218
(0.127)
2.818
(0.111)
2.418
(0.095)
1.618
(0.064)
1.218
(0.048)
(Note: Engineering designator is 30SPA0557)
0.818
(0.032)
0.0
0.0
1.000
(0.039)
14
2.818
(0.111)
3.218
(0.127)
1.000
(0.039)
3.700
(0.146)
30SPA0557
27.0-32.0 GHz GaAs MMIC
Power Amplifier
May 2005 - Rev 20-May-05
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.588 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1A)
Bond Pad #3 (Vd1A)
Bond Pad #4 (Vg2A)
Bond Pad #5 (Vd2A)
Bond Pad #6 (Vg3A)
Bond Pad #7 (Vd3A)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vd3B)
Bond Pad #10 (Vg3B)
Bond Pad #11 Vd2B)
Bond Pad #12 (Vg2B)
Bond Pad #13 (Vd1B)
Bond Pad #14 (Vg1B)
Page 3 of 5
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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