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參數(shù)資料
| 型號： | 3149-1-00-01-00-00-08-0 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 終端 |
| 英文描述： | BRASS, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 91K |
| 代理商： | 3149-1-00-01-00-00-08-0 |
ProductNumber:3149-1-00-01-00-00-08-0
Description:
3149
- Solder Mount PCB Pin
Packaging:
Packaged in Bulk
Mill-Max
Part
Number
ShellPlating
ContactPlating
RoHS
Compliant
3149-1-00-01-00-00-08-0
200 - 300 μ" Tin/Lead over Nickel
00
SHELLMATERIAL:
BRASSALLOY
(UNS C36000) per ASTM B 16
PropertiesofBRASSALLOY:
Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1%
Hardness as machined: 80-90 Rockwell B
Density: .307 lbs/in3
Electrical conductivity: 26% IACS*
Melting point: 900°C/885°C (liquidus/solidus)
(3 to 4% lead is used to permit "free machining" and is permitted by EC Directive 2002/95Annex 6; so all pin materials
are RoHS compliant)
*International Annealed Copper Standard, i.e. as a % of pure copper.
CertificateofCompliance:
This is to Certify that the product described above is manufactured to Mill-Max quality standards in accordance with all
applicable specifications and drawing. Mill-Max certifies this product to be free from defects of materials and workmanship.
This Certificate of Compliance covers the following requirements:
Dimensional (all features verified to be within tolerances described on the applicable drawing).
Raw Material (materials and properties verified to be as described on the applicable drawing).
Plating (platings as required, thickness verified, and performance including solderability per mil-standard).
Performance (insertion extraction or other force requirements as described on the applicable drawing).
ComplianceStatementforRegistration,Evaluation,AuthorizationandRestrictionofChemicals(REACH)
Mill-Max Mfg. Corp. Datasheet — Last Modified 2/19/2011
Page 1 of 2
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 3149-1-00-15-00-00-08-0 | 功能描述:IC 與器件插座 10u AU OVER NI RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 3149-1-00-21-00-00-08-0 | 功能描述:IC 與器件插座 20u AU OVER NI RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 3149-1-00-34-00-00-08-0 | 功能描述:IC 與器件插座 50u AU OVER NI RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 3149-1-00-80-00-00-08-0 | 功能描述:IC 與器件插座 200u SN OVER NI RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 314915-002 | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:Dual-Core Intel Xeon Processor |
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