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參數(shù)資料
| 型號： | 4015-0-67-80-30-84-10-0 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 終端 |
| 英文描述： | BERYLLIUM COPPER, TIN (100) OVER NICKEL FINISH, PCB TERMINAL |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 1/1頁 |
| 文件大小： | 159K |
| 代理商： | 4015-0-67-80-30-84-10-0 |
1,8
1,22 DIA.
1,52
0,25
0,23
0,97 DIA.
0,71 DIA.
5359-0-XX-XX-10-XX-10-0
Solder mount in 1,09±0,08 PTH.
#10 Contact for 0,3-0,43 pins.
Also available on 16mm wide carrier
tape: 3,000 parts per 330mm reel.
5359
2,54
1,47 DIA.
2,18
0,64
0,23
1,02 DIA.
0,79 DIA.
0577-0-XX-XX-21-XX-10-0
Solder mount in 1,14±0,08 PTH.
#21 Contact for 0,38-0,56 pins.
Also available on 12mm wide carrier
tape: 3,000 parts per 330mm reel.
0577
2,54
1,73 DIA.
2,26
0,51
0,23
1,32 DIA.
1,09 DIA.
4015-0-XX-XX-30-XX-10-0
Solder mount in 1,45±0,08 PTH.
#30 Contact for 0,38-0,64 pins.
Also available on 8mm wide carrier
tape: 5,500 parts per 330mm reel.
4015
3435
SPECIFICATIONS
SHELL MATERIAL:
Brass Alloy 360, 1/2 Hard
CONTACT MATERIAL:
Beryllium Copper Alloy 172, HT
SOLDER BARRIER:
Organic Fibre Plug
DIMENSION IN INCHES
TOLERANCES ON:
LENGTHS:
±0,13
DIAMETERS: ±0,05
ANGLES:
± 2°
These through-hole (tubular) receptacles are designed for
hand, wave or reflow* soldering. The
ORGANIC FIBRE PLUG
barrier prevents solder, paste or flux from contaminating the
spring contact.
After soldering, the
OFP barrier is pushed out of the recep-
tacle when the device is plugged in.
All parts are available as discrete receptacles; but for SMT
assembly, certain receptacles are supplied on carrier tape per
EIA-481 to feed industry standard pick and place machines.
*Intrusive reflow (also called "pin-in-paste") is a technique of using conventional
through-hole components in a reflow soldering process. The receptacles are
placed into plated through-holes in the circuit board (solder paste has previous-
ly been screen printed on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components.
Solder will fill the plated through-holes and achieve solder joints as reliable as wave soldering. The OFP barrier prevents solder
paste from being picked-up inside the contact during pick ‘n place assembly. "Overprinting" paste on the solder mask can be
used to adjust the volume of paste required to fill each hole.
PINS
M
A HINE
D
C
PR
EC
ISI
ON
PIN RECEPTACLES
With Organic Fibre Plug Solder Barrier
(see specific contact range on pages 216, 217, 218 & 221)
www.mill-max.com
516-922-6000
164
3435-0-XX-XX-47-XX-04-0
Solder mount in 1,17±0,08 PTH.
#47 Contact for 0,64-0,91 and
0,64 square pins.
3,30
5,33
0,23
2,24
1,63 DIA.
1,55 DIA.
0,91 DIA.
1,09 DIA.
1,83 DIA.
0,76
ORDER CODE: XXXX - 0 - XX - XX - XX - XX -XX - 0
BASIC PART #
SPECIFY PACKAGING:
SPECIFY CONTACT FINISH:
43 Discrete Receptacles
27 0,76μm GOLD OVER NICKEL (RoHS)
67 Supplied on 13” Reels
02 2,54
μm TIN/LEAD OVER NICKEL
SPECIFY SHELL FINISH:
84 2,54μm TIN OVER NICKEL (RoHS)
01 5,08
μm TIN/LEAD OVER NICKEL
80 5,08μm TIN OVER NICKEL (RoHS)
CONTACT
#10, #21, #30 or #47 CONTACT (DATA ON PAGES 216, 217, 218 & 221)
RoHS
2002/95/EC
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 4015-0-43-80-30-02-10-0 | BERYLLIUM COPPER, TIN LEAD (100) OVER NICKEL FINISH, PCB TERMINAL |
| 4015-0-67-01-30-27-10-0 | BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL |
| 4015-0-67-01-30-84-10-0 | BERYLLIUM COPPER, TIN (100) OVER NICKEL FINISH, PCB TERMINAL |
| 4015-0-67-01-30-02-10-0 | BERYLLIUM COPPER, TIN LEAD (100) OVER NICKEL FINISH, PCB TERMINAL |
| 4015-0-43-80-30-84-10-0 | BERYLLIUM COPPER, TIN (100) OVER NICKEL FINISH, PCB TERMINAL |
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