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參數(shù)資料
| 型號(hào)： | 43650-1110 |
| 廠商： | MOLEX INC |
| 元件分類(lèi)： | 電路板相疊連接器 |
| 英文描述： | Header; Number of Contacts:11; Pitch Spacing:0.118"; Number of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer |
| 中文描述： | 11 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT |
| 封裝： | LEAD FREE |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 83K |
| 代理商： | 43650-1110 |
MX07 E-95
E
Power
Connectors
3.00mm (.118") Pitch
Micro-Fit 3.0
Wire-to-Board
Header
43650
Single Row, Right Angle, SMT
With Solderable Retention Clip
F
Features and Benefits
■
Solderableretentionclipprovidesoptimumretention
toPCB
■
Fullypolarizedtomatingreceptacle
■
Tapeandreelpackagingeliminateshandlingand
provideshigherinsertionspeedcomparedtotray
packingorhandassembly
Reference Information
ProductSpecification:PS-43650
Packaging:Tapeandreel
ULFileNo.:E29179
CSAFileNo.:LR19980A
TUVLicenseNo.:R72040445
MatesWith:43645
DesignedIn:Millimeters
Electrical
Voltage:250V
Current:5.0Amax.
ContactResistance:10milliohmsmax.
DielectricWithstandingVoltage:1500VAC
InsulationResistance:1000Megohmsmin.
Mechanical
InsertionForcetoPCB:7.5kgfmax.(16.5lb)
Physical
Housing:HightemperatureLCP,UL94V-0
Contact:Brass
Plating:TinorGold
Circuits
Order No.
Lead-free
Tin
15m" Gold
30m" Gold
2
Yes
3
4
5
6
7
Circuits
Order No.
Lead-free
Tin
15m" Gold
30m" Gold
8
Yes
9
10
11
12
3.00mm (.118") Pitch
Micro-Fit 3.0
Wire-to-Board
Header
43650
Single Row, Right Angle, SMT
With Solderable Fitting Nail
Features and Benefits
■
SoldertabsprovideretentiontoPCB
■
Fullypolarizedtomatingreceptacle
■
Tapeandreelpackagingeliminateshandlingand
provideshigherinsertionspeedscomparedtotray
packingorhandassembly
Reference Information
ProductSpecification:PS-43650
Packaging:Tapeandreelforroboticplacement
ULFileNo.:E29179
CSAFileNo.:LR19980A
TUVLicenseNo.:R72040445
MatesWith:43645
DesignedIn:Millimeters
Electrical
Voltage:250V
Current:5.0Amax.
ContactResistance:10milliohmsmax.
DielectricWithstandingVoltage:1500VAC
InsulationResistance:1000Megohmsmin.
Physical
Housing:HightemperatureLCP,UL94V-0
Contact:Brass
Plating:TinorGold
Circuits
Order No.
Lead-free
Tin
15m" Gold
30m" Gold
2
Yes
3
4
5
6
7
Circuits
Order No.
Lead-free
Tin
15m" Gold
30m" Gold
8
Yes
9
10
11
12
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 43650-1112 | Header; Number of Contacts:11; Pitch Spacing:0.118"; Number of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer |
| 43650-1113 | Header; Number of Contacts:11; Pitch Spacing:0.118"; Number of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer |
| 43650-1209 | Header; Number of Contacts:12; Pitch Spacing:0.118"; Number of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer |
| 43650-1210 | Header; No. of Contacts:12; Pitch Spacing:0.118"; No. of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer |
| 43650-1212 | Header; No. of Contacts:12; Pitch Spacing:0.118"; No. of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 43650-1110-P | 制造商:Molex 功能描述:CONN HEADER 11POS 3MM RT ANG SMD |
| 43650-1111 | 功能描述:集管和線殼 MicroFit 3.0 SR RA SMT Clip 30Au 11Ckt RoHS:否 產(chǎn)品種類(lèi):1.0MM Rectangular Connectors 產(chǎn)品類(lèi)型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類(lèi)型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類(lèi)型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector |
| 436501112 | 制造商:Molex 功能描述: |
| 43650-1112 | 功能描述:集管和線殼 3MM MICRO-FIT RA 11 CKT Tin RoHS:否 產(chǎn)品種類(lèi):1.0MM Rectangular Connectors 產(chǎn)品類(lèi)型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類(lèi)型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類(lèi)型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector |
| 43650-1112-P | 制造商:Molex 功能描述:CONN HEADER 11POS 3MM RT ANG SMD 制造商:Molex 功能描述:Conn Power HDR 11 POS 3mm Solder RA SMD 11 Terminal 1 Port T/R |
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