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參數(shù)資料
| 型號： | 440SPE |
| 廠商： | Applied Micro Circuits Corp. |
| 英文描述： | PowerPC 440SPe Embedded Processor |
| 中文描述： | 嵌入式處理器的PowerPC 440SPe |
| 文件頁數(shù)： | 1/80頁 |
| 文件大小： | 572K |
| 代理商： | 440SPE |
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Part Number 440SPe
Revision 1.23 - Sept 21, 2006
AMCC Proprietary
1
PowerPC 440SPe Embedded Processor
Preliminary Data Sheet
Features
PowerPC 440 processor core operating up to
667 MHz with 32KB I- and D-caches (with parity
checking)
On-chip 256KB SRAM configurable as L2 Cache
or Ethernet Packet/Code store memory
Selectable Processor vs Bus clock ratios (Refer to
the Clocking chapter in the PPC440SPe
Embedded Processor User’s Manual for details)
Support up to 16 GB (4 Chip Selects) of 64-bit/32-
bit SDRAM with ECC
DDR I 266-333-400
DDR II 400-533-667
Three PCI-Express serial interfaces:
one 8 lanes and two 4 lanes - 2.5Gb/s per lane
Root and Endpoint support.
Opaque bridge
One 64-bit DDR PCI-X interfaces up to 133 MHz
(DDR 266) with support for conventional PCI
Optional: High throughput RAID 6 hardware
acceleration, performs XOR and Galois Field P &
Q parity computations, supports up to 255 drives
Optional:16 Programmable Galois Field
polynomials including 14d and 11d
XOR Accelerator with DMA controller
I2O messaging with two DMA controllers
External Peripheral Bus (16-bit Data, 27-bit
Address) for up to three devices; Bank0=16 MB,
Bank1 and Bank2=128 MB each
One Ethernet 10/100/1000Mbps half- or full-
duplex interface. Operational modes supported
are MII and GMII.
Programmable Interrupt Controller supports
interrupts from a variety of sources.
Programmable General Purpose Timers (GPT)
Three serial ports (16750 compatible UART)
Two IIC interfaces
General Purpose I/O (GPIO) interface available
JTAG interface for board level testing
Processor can boot from PCI memory
Description
Designed specifically to address high-end embedded
applications for storage, the PowerPC 440SPe
(PPC440SPe) provides a high-performance, low
power solution that interfaces to a wide range of
peripherals by incorporating on-chip power
management features and lower power dissipation.
This chip contains a high-performance RISC
processor core, a DDR1/DDR2 SDRAM controller,
configurable 256KB SRAM to be used as L2 cache or
software-controlled on-chip memory, three PCI-
Express interfaces, one DDR PCI-X bus interface, a
1Gbps Ethernet interface, an I2O/DMA controller,
control for external ROM and peripherals, optional
RAID 6 acceleration, an XOR DMA unit, serial ports,
IIC interfaces, and general purpose I/O.
Technology: CMOS Cu-11, 0.13mm
Package: 27mm, 675-ball, 1mm pitch, Flip Chip-
Plastic Ball Grid Array (FC-PBGA)
Power (estimated): Less than 14W @533MHz
Supply voltages required: 3.3V, 2.5V, 1.8V, 1.5V
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