
Board Mountable
DC-DC Converters
IMS 7 Series
Edition 6/4.2000
16/16
Description of Options
Table 17: Survey of options
Function
Option
SMD version with pins
M
SMD version with PCB lid
L
Open frame version
Z
C-pinout
C
Option C
The C-pinout configures the electrically isolated double out-
puts to the "industrial pinout" Vo1+, Vo2– with common
ground Go. With the C-pinout the converter height is in-
creased by the adapter PCB (see also:
Mechanical Data).
Option M and L
Surface mount version
Note: Precautions should be taken when reflow soldering
the SMD version. The reflow soldering instructions below
should be strictly adhered to. An inadequate soldering proc-
ess may permanently damage the converter or degrade its
performance and Power-One will not honour any guaran-
tee/warranty claims resulting from damage caused by ig-
noring the soldering instructions.
Infrared soldering is not permitted.
The surface mountable version of this product is assem-
bled with high melting point solder (227
°C) to ensure that
the solder joints of of the internal components do not de-
grade in the end users SMD soldering process.
This product is only specified for "Forced Convection
Reflow Soldering" (Hot Air). Any conventional soldering
profile is acceptable provided that the restriction curve be-
low is not exceeded at any time during the reflow process.
Accessories
Mounting supports for chassis and DIN-rail mounting.
Fig. 29
Proposed solder lands option M
50
3.81
Top view
09119
4
x
3.81
25.4
3
x
5.8
3.81
4
2
210
220
230
240
0
10
20
30
Tpeak [°C]
11051
40
t [s]
50
205
215
225
235
Fig. 28
Forced convection reflow soldering restriction curve
measured on pin 2
24
(0.94")
2.8
(0.11")
3.6 (1.4")
8 x 5 (1.9")
Foot print
Fig. 30
Proposed solder lands option L