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參數資料
型號: 4951G
廠商: Aavid Thermalloy
文件頁數: 57/116頁
文件大小: 0K
描述: THERMAL EPOXY
MSDS 材料安全數據表: 4951A THERMALBOND MSDS
4951B THERMALBOND MSDS
標準包裝: 1
系列: Thermalbond™
類型: 環氧樹脂硬化劑
尺寸/尺寸: 3.5 盎司包裝
其它名稱: 033869
45
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5744, 5745, 5746, 5749
Low cost, labor saving, slide on heat sink featuring spring action
Low cost, labor saving, slide on
heat sink features spring action
to firmly hold the device tab to the
heat sink providing maximum metal
to metal contact and good thermal
conduction. Available with solder-
able tabs for horizontal or vertical
mounting to the PC board.
9.52
(0.375)
21.08
(0.830)
HOLDING TABS
DITTIN
11.81
(0.465)
10.03
(0.395)
21.84
(0.860)
14.99
(0.590)
"A"
3.18
(0.125)
9.02
(0.355)
3.81
(0.150)
1.57
(0.062)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
01
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
574402
574502
5741
Low cost, labor saving, slide on heat sink featuring spring action
Low cost, labor saving, slide on heat sink
features spring action to firmly hold the device
tab to the heat sink providing maximum metal
to metal contact and good thermal conduction.
Includes a clearance hole in the top side to allow
the use of optional hardware to attach device
and heat sink to circuit board or other surface.
Also available with solderable tabs for vertical
mounting to the PC board.
21.84
(0.860)
9.02
(0.355)
19.05
(0.750)
3.81
(0.150)
10.03
(0.395)
11.81
(0.465)
14.99
(0.590)
20.57
(0.810)
7.62
(0.300)
CLEARANCE
DITTIN
9.52
(0.375)
5.33
(0.210)
1.57
(0.062)
THRU
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
0
1
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
574102B00000G
Low cost slide on heat sink, no solderable tabs
574102B03300G
With solderable tabs
1.91 (0.075)
ORDERING INFORMATION
10.03
(0.400)
1.57
(0.062)
5.33
(0.210)
9.52
(0.375)
9.02
(0.355)
HOLDING TABS
20.57
(0.810)
21.84
(0.860)
"A"
4.19
(0.165)
11.81
(0.465)
14.99
(0.590)
DITTIN
TAB
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Part Number
Description
Figure
“A” Dim
574402B00000G
Low cost slide on heat sink, no solderable tabs
A
19.05 (0.750)
574402B03200G
With solderable tabs for horizontal mounting
A
19.05 (0.750)
1.91 (0.075)
574502B00000G
Low cost slide on heat sink, no solderable tabs
B
19.05 (0.750)
574502B03300G
With solderable tabs for vertical mounting
B
19.05 (0.750)
1.91 (0.075)
574602B00000G
Low cost slide on heat sink , no solderable tabs
B
17.53 (0.690)
574602B03300G
With solderable tabs for vertical mounting
B
17.53 (0.690)
1.91 (0.075)
574902B00000G
Low cost slide on heat sink , no solderable tabs
B
35.05 (1.380)
574902B03300G
With solderable tabs for vertical mounting
B
35.05 (1.380)
1.91 (0.075)
Position
Code
Description
Details
A
37
Solderable tab with step to limit insertion depth
Page 92
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
20
0
20
40
60
80
100
0
1
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
574902
574602
POPULAR OPTIONS:
Base part no.
A
574102B0 00 00G
For additional options see page 82
FIGURE A
FIGURE B
For additional options see page 82
Mounting
Kits
page 99
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