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參數(shù)資料
| 型號： | 5-210797-3 |
| 元件分類： | 插座 |
| 英文描述： | PGA145, IC SOCKET |
| 文件頁數(shù)： | 1/1頁 |
| 文件大小： | 120K |
| 代理商： | 5-210797-3 |
5-210797-3 Product Details
5-210797-3
T E I nternal N umber: 5 -2 1 0 7 9 7 -3
PGA Sockets
Product Highlights:
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Ultra Low Insertion Force
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145 Positions
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PCB Mount Style = Through Hole
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Grid Size = 15x15
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Grid Spacing = Standard: 2.54 x 2.54 mm
Quick Links
Documentation & Additional Information
Product Drawings:
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None Available
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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None Available
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
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None Available
Additional Information:
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Related Products:
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Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
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Insertion Force = Ultra Low
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Number of Positions = 145
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PCB Mount Style = Through Hole
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Grid Size = 15x15
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Grid Spacing (mm [in]) = Standard: 2.54 x 2.54 [.100 x .100]
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Chip Compatibility = Other
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Frame Style = Open
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Sleeve Material = Phosphor Bronze
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Heat Sink Attachment = Without
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Profile = Standard
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Leg Style = ACTION PIN
Termination Related Features:
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Termination Post Length (mm [in]) = 4.04 [0.159]
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Socket Identifier = None
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Solder Tail Contact Plating = Tin-Lead over Nickel
Body Related Features:
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Assembly Process Feature = None
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Socket Overall Height (mm [in]) = 4.46 [0.176]
Contact Related Features:
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Contact Style = Stamped + Formed
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Contact Base Material = Beryllium Copper
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Contact Plating, Mating Area, Material = Gold (30)
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Sleeve Plating = Tin-Lead (120) over nickel
Housing Related Features:
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Housing Color = Black
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Housing Material = Thermoplastic - GF
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Housing Flammability Rating = UL 94V-0
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Housing Material Temperature = High
Industry Standards:
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RoHS/ELV Compliance = Not reviewed for ELV/RoHS compliance
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Lead Free Solder Processes = Not reviewed for lead free solder
process
Operation/Application:
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Application = Production
Packaging Related Features:
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Packaging Method = Tube
Other:
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Brand = AMP
Corporate Information
Quick Links
Customer Support
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