
MVL-504G
MVL-504Y
MVL-504HR
MVL-504DR
MVL-504UR
Description
Package Dimensions
Applications
l
Popular T-1 3/4 (
φ5
mm) diameter package
l
I.C. compatible / Low current requirement
l
Low power consumption
l
General purpose leads
l
Reliable and rugged
Absolute Maximum Tatings
GREEN
100
120
30
0.4
5
YELLOW
60
80
20
0.25
5
HR
100
120
30
0.4
5
DR/UR
100
120
40
0.5
5
Power Dissipation
Peak Forward Current (1/10 Duty Cycle 0.1ms pulse width)
Continuous Forward Current
Derating Linear From 25
o
C
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature (1.6mm from body) for 3 seconds at 260
o
C
Pad
Ipf
Iaf
mW
A
mA/
o
C
mA
V
V
R
Topr
Tstg
Arsenide diode.
-55
o
C to + 100
o
C
Parameter
Symbol
Maximum Rating
-55
o
C to + 100
o
C
Unit
chip is made with Gallium Phosphide on Gallium Phosphide
diode. The red (DR) chip is made with Aluminum Gallium
Arsenide on Gallium Arsenide diode. The red (UR) chip is
made with Aluminum Gallium Arsenide on Aluminum Gallium
The MVL-504xx series package are T-1 3/4 (
φ5
mm) standard
water clear plastic lens package. The Hi-EFF red (HR)
and yellow LED chips are made with Gallium Arsenide
Phosphide on Gallium Phosphide diode. The green LED
Unity Opto Technology Co., Ltd.
A
C
1.00
(.040)
1.00MIN.
(.040)
7.62
(.300)
5.05
(.200)
2.54
(.100)
25.40 MIN.
(1.000)
0.50 TYP.
(.020)
5.90
(.230)
5.47
(.215)
FLAT DENOTES CATHODE
Unit: mm ( inches )
Notes :
1. Tolerance is ± 0.25 mm (.010") unless otherwise noted.
2. Protruded resin under flange is 1.5 mm (.059") max.
3. Lead spacing is measured where the leads emerge from the package.