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參數(shù)資料
| 型號(hào)： | 508-AG4A |
| 廠商： | THOMAS BETTS CORP |
| 元件分類： | 插座 |
| 英文描述： | DIP8, IC SOCKET |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 55K |
| 代理商： | 508-AG4A |
G
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
G2
Quality & Innovation From The
Product Group
500 Series Numerical Display Sockets
FEATURES:
Augat offers a wide range of LED and ganged unit sockets to
allow for total flexibility and size variations while incorporating
the design features of our standard 500 Series sockets.
Two-piece tapered entry socket terminal — four-fingered, gold plated
inner contact and machined tin/lead plated outer sleeve.
Available in either solderless wrap or printed circuit termination.
Horizontal or right angle mounting.
MATERIAL SPECIFICATIONS (Figures 1, 2, 3):
Inner Contact .................. Four-fingered beryllium copper, gold
Outer Sleeve .................. Machined brass, tin/lead plated
Insulator ........................ Thermoplastic polyester UL rated 94V-0
MATERIAL SPECIFICATIONS (Figure 4):
Inner Contact .................. Four-fingered beryllium copper, gold
Outer Sleeve .................. Brass, tin/lead plated
Board .............................. Glass epoxy, tin-plated copper circuitry
Terminal ........................ Phosphor bronze, solder-coated
Spacer ............................ Delrin
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition II, 10 G's
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition C, 100 G's
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 200 Grams (7.0 oz.) average with .018" (0,46) dia.
polished steel pin
Insertion Force .............. 179 Grams (6.3 oz.) average with .018 (0,46)" dia.
polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with .018" (0,46) dia.
polished steel pin
Solderability .................. Passed MIL-STD-202F, Method 208
Sleeve Retention
in Plastic .................... 3.5 Lbs. per line minimum solderless wrap;
3.0 Lbs. PC tail
Inner Contact
Retention .................... 7.5 Lbs. per line average
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. @ 500 VDC per
MIL-STD-1344, Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature .. Gold inner contact -55
°C to +125°C
Tin/lead inner contact -55
°C to +105°C
518-AG7D
516-AG21D
508-AG8D
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 508-AG8D | DIP8, IC SOCKET |
| 516-AG7D | DIP16, IC SOCKET |
| 520-AG7D | DIP20, IC SOCKET |
| 516-AG21D | DIP16, IC SOCKET |
| 508-AG8D-3E | DIP24, IC SOCKET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 508-AG4F | 制造商:TE Connectivity 功能描述:DIP Sockets |
| 508-AG8D | 功能描述:IC 與器件插座 IC SOCKET 300 RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 508-AG8D-2E | 制造商:TE Connectivity 功能描述: |
| 508-AG8D-3 | 制造商:TE Connectivity 功能描述: |
| 508-AG8D-3E | 制造商:TE Connectivity 功能描述: |
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