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| 型號： | 520-AG11D |
| 廠商： | THOMAS BETTS CORP |
| 元件分類： | 插座 |
| 英文描述： | DIP20, IC SOCKET |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 126K |
| 代理商： | 520-AG11D |
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
A10
A
Quality & Innovation From The
Product Group
500 Series DIP Socket with Four-Fingered Contact & Solid Insulator
FEATURES:
The Augat 500 Series Socket features a precision four-finger inner contact
to produce the industry standard for high reliability screw machine sockets.
Precision four-finger inner contact provides concentric funnel entry for
easy flat and round lead insertion
Machined (Premium Series) and stamped (Economy Series) contacts
are available
"X" & "Y" stackable
Non-wicking, closed bottom sleeve gives 100% protection against flux
and solder contamination. Choice of solderless wrap or PC termination
Accommodates 6 through 40 pin DIPS, rectangular or round leads
Recognized under the Component Program of Underwriters
Laboratories, Inc. file no. E111362
Beryllium copper inner contact for maximum mechanical and
electrical performance
For extreme conditions involving shock and vibration, Augat's high
retention series is available
APPLICATION DIMENSIONS:
PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
PCB Hole Size Range:
.035"
± .002" (0,89 ± 0,05) PC tail,
.055"
± .003" (1,40 ± 0,08) solderless wrap
IC Pin Dimension Range: .009" x .015" (0,23 x 0,38) through
.011" x .020" (0,28 x 0,51)
.016" to .021" (0,41 to 0,53) round lead,
.105" (2,67) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL rated 94V-0
Sleeve ............................ Machined brass/formed copper
Contact .......................... Beryllium copper
Sleeve Plating ................ Tin/lead or gold
Contact Plating .............. Premium or Economy Series (ES) - gold or
tin/lead
Economy Series (ESL) - low gold
Vapor Phase/IR Compatible
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition II, 10 G’s
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition C, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 125 Grams (4.4 oz.) average with .018" (0,46) dia.
polished steel pin (Premium Series)
200 Grams (7.1 oz.) average with .018" (0,46) dia.
polished steel pin (Economy Series)
Inner Contact Retention
in Sleeve ...................... 7.5 Lbs. per line average
Sleeve Retention
in Plastic ..................... 3.0 Lbs. per line minimum
Solderability .................. Passed MIL-STD-202F, Method 208
Insertion Force .............. Premium - 134 Grams (4.7 oz.) average with a
.018" (0,46) dia. polished steel pin
Economy - 179 Grams (6.3 oz.) average with a
.018" (0,46) dia. polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)
(Premium and Economy)
dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms max.
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. @ 500 VDC per
MIL-STD-1344, Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature .. Gold inner contact -55
°C to +125°C,
Tin/lead inner contact -55
°C to +105°C
Wide tapered entry
Precision
four-finger
inner contact
Solderless wrap
or PC termination
Non-wicking
closed bottom
Low profile
“X” & “Y”
stackable
insulator
528-AG11D-ES
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| 522-AG12D | DIP22, IC SOCKET |
| 524-AG10D-ES | DIP24, IC SOCKET |
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| 528-AG10D | DIP28, IC SOCKET |
| 540-AG12D | DIP40, IC SOCKET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 520-AG11D-ES | 功能描述:IC 與器件插座 SOLID FRAME PC 20P RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 520-AG11D-ESL | 制造商:TE Connectivity 功能描述:520-AG11D-ESL SOCKET ASSY |
| 520-AG11D-ES-LF | 制造商:TE Connectivity 功能描述: |
| 520-AG11D-ESL-LF | 制造商:TE Connectivity 功能描述:CONN SOCKET 20POS DIP GOLD T/H |
| 520-AG11D-LF | 功能描述:IC 與器件插座 DIP .3CL 20P S/M CFRM AU/SN RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
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