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參數資料
型號： 533202B02551G
廠商： Aavid Thermalloy
文件頁數： 49/116頁
文件大小： 0K
描述： BOARD LEVEL HEAT SINK
產品培訓模塊： How to Select a Heat Sink
標準包裝： 100
類型： 插件板級，垂直
冷卻式包裝： TO-220
固定方法： 夾和 PC 引腳
形狀： 矩形
長度： 2.003"（50.88mm）
寬： 1.375"（34.93mm）
機座外的高度（散熱片高度）： 0.500"（12.70mm）
溫升時的功耗： 3W @ 30°C
在強制氣流下的熱敏電阻： 在 400 LFM 時為3°C/W
自然環境下的熱電阻： 9°C/W
材質： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 041720
38
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5041, 5042
Economy, narrow base, low profile channel style heat sink
Economy, narrow base, low profile
channel style heat sink is perfect for
use on printed circuit boards with tight
component spacing. Models are available
for single and dual device mounting.
17.80
(0.700)
3.66
(0.144)
THRU
13.46
(0.530)
21.60
(0.850)
19.80
(0.780)
"X"
Part Number
Description
Figure
504102B00000G
Economy, narrow base channel style heat sink
A
504222B00000G
For dual devices
B
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
504222
504102
Moun
ting
Sur
fac
eT
emp
Rise
A
bo
ve
Ambien
t—°C
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Position
Code
Description
Location
Details
A
01
6-32 Wave On threaded insert 0.100 stand off
Hole X
Page 89
21.59
(0.850)
13.47
(0.530)
36.83
(1.450)
3.66
(0.144)
THRU TYP 2
19.81
(0.780)
9.91
(0.390)
"X"
13.47
(0.530)
Economy, narrow base, low profile
channel style heat sink is perfect for use
on printed circuit boards with 0.500 inch
centering. When mounted horizontally, the
total height of the heat sink is just 0.380.
9.65
(0.380)
9.52
(0.375)
13.34
(0.525)
3.81
(0.150)
THRU
19.05
(0.750)
19.05
(0.750)
L
C
"X"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
01
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Finish
507302B00000G
Black anodize
507302J00000G
Pre-black anodize*
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Position
Code
Description
Location
Details
A
09
Stud 4–40 x 0.350 LG
Hole X
Page 96
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information
5073
Economy, narrow base, low profile channel style heat sink
7141
Copper narrow channel style heat sink with integrated clip
Copper narrow channel style heat
sink with integrated clip and locking
tab for secure attachment to the device.
Single center tab can be soldered
directly to the PC board.
19.81
(0.780)
5.72
(0.225)
1.27
(0.050)
3.81
(0.150)
3.05
(0.120)
13.08
(0.515)
13.21
(0.520)
Top is cut
away to
show detail
2.54
(0.100)
MAX
16.51
(0.650)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
Case
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
0
1
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
Case
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
7141DG
Narrow channel heat sink with integrated clip
2.77 (0.109)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A
FIGURE B
POPULAR OPTIONS:
Base part no.
A
507302 _ 000 00G
POPULAR OPTIONS:
Base part no.
A
504_ _2B0 00 00G
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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