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參數(shù)資料
| 型號(hào)： | 540-10-361-10-005454 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 插座 |
| 英文描述： | BGA361, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 1/4頁(yè) |
| 文件大小： | 4028K |
| 代理商： | 540-10-361-10-005454 |
BALL GRID ARRAYS
For .050” Grid
Male Pin Adapters & Female Socket
www.mill-max.com
516-922-6000
112
Series 587, 582
FOR BGA MOUNT ADAPTER PINS
FOR BGA FEMALE SOCKET
2
7
8
BGA adapter/socket systems are a reliable way to make BGAs pluggable,
they may also be used as a high density board-to-
board interconnect.
The BGA device is soldered to a 8737/4048
adapter (or a 4098/4054 adapter is soldered
to a PCB); and then either one can be plugged
into a 8214 surface mount socket.
Both socket and adapter have the same footprint as the
BGA device.
Insertion force is .40N per pin for standard pins 8737/4098.
Tapered EZ-IN pins 4048/4054 reduce insertion force to only .08N,
and are recommended for pin counts greater than 500.
A pry-bar tool (part #828-01-010) is available for extraction.
Insulator material is FR-4 epoxy having a TCE to match the BGA device
and circuit board.
.034 DIA.
.018 DIA.
.034 DIA.
.016 DIA.
.013 DIA.
.127
.062 .068
.043 DIA.
.036 DIA.
.022 DIA.
.024
.062 .115
.140
Ordering Information
Series
Plating
Window
8
1 0
4
7
Code
-
--
No. of pins
Grid size
Pattern #
Determined from footprint pattern pages 113 to 115
3
SPECIFY PLATING CODE XX=
Sleeve (Pin)
Contact (Clip)
11
10
μ”Au
10
μ”Au
Series
Plating
Window
1 1
4
Code
-
--
-
No. of pins
Grid size
Pattern #
Determined from footprint pattern pages 113 to 115
1
PLATING CODE XX=
Pin Plating
10
10
μ”Au
BGA MOUNT ADAPTER PINS
5
0
4
1 0
4
8
-
--
4
5
FOR PCB MOUNT STANDARD ADAPTER PIN
0
4
1 0
4
8
-
--
9
5
FOR PCB MOUNT EZ-IN ADAPTER PIN
0
4
1 0
4
-
--
5
EZ-IN
PIN
STAN-
DARD
.022 DIA.
.034 DIA.
.018 DIA.
.062
.127
.091
.023
.022 DIA.
.034 DIA.
.016 DIA.
.013 DIA.
.062
.127
.091
.023
STANDARD
PIN #8737
EZ-IN
PIN #4048
PCB MOUNT STANDARD
ADAPTER PIN #4098
PCB MOUNT EZ-IN
ADAPTER PIN #4054
SMT RECEPTACLE
TYPE #8214
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