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參數(shù)資料
| 型號(hào)： | 587-10-316-10-005437 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 插座 |
| 英文描述： | BGA316, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大小： | 215K |
| 代理商： | 587-10-316-10-005437 |
ProductNumber:587-10-316-10-005437
316-10-005
20X20
Description:
BGA Header
.050 Grid; BGA Header
PlatingCode:
10
ShellPlating:
10 μ" Gold over 100 μ" Nickel
#
Of
Pins
Mill-Max
Part
Number
RoHS
Compliant
316
587-10-316-10-005437
LOOSEPIN:
Pin Used: 8737 (Brass Alloy)
BRASSALLOY (UNS C36000) per ASTM B 16
PropertiesofBRASSALLOY:
Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1%
Hardness as machined: 80-90 Rockwell B
Density: .307 lbs/in3
Electrical conductivity: 26% IACS*
Melting point: 900°C/885°C (liquidus/solidus)
(3 to 4% lead is used to permit "free machining" and is permitted by EC Directive 2002/95Annex 6; so all pin
materials are RoHS compliant)
*International Annealed Copper Standard, i.e. as a % of pure copper.
INSULATORINFORMATION:
FR-4 Laminate
High Temperature
PropertiesofFR-4Laminate:
Epoxy/Glass Laminate. Thicknesses available: .010", .020", .031", .047", .062", .093", .125" (natural color, beige)
ENVIRONMENTAL DATA:
Operating temperature range: -55/+125 °C
Shock (No electrical discontinuity greater than 1μs):50 G
Solderability: 364-52
Resistance to soldering heat: 364-56A Test Cond. C
Mill-Max Mfg. Corp. Datasheet — Last Modified 6/6/2009
Page 1 of 2
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
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