參數資料
| 型號： | 592902B03400G |
| 廠商： | Aavid Thermalloy |
| 文件頁數： | 18/116頁 |
| 文件大小： | 0K |
| 描述： | BOARD LEVEL HEAT SINK |
| 產品培訓模塊： | How to Select a Heat Sink |
| 標準包裝： | 500 |
| 類型： | 插件板級，垂直 |
| 冷卻式包裝： | TO-220 |
| 固定方法： | 螺栓固定和 PC 引腳 |
| 形狀： | 矩形 |
| 長度： | 0.980"（24.89mm） |
| 寬： | 0.942"（23.93mm） |
| 機座外的高度（散熱片高度）： | 0.500"（12.70mm） |
| 溫升時的功耗： | 1W @ 20°C |
| 在強制氣流下的熱敏電阻： | 在 400 LFM 時為6.0°C/W |
| 自然環境下的熱電阻： | 17.9°C/W |
| 材質： | 鋁 |
| 材料表面處理： | 黑色陽極化處理 |
| 其它名稱： | 042032 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁當前第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁
114
A
C
CESSORIES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Grease & Epoxy
Ther-O-Bond
TM 1500 is a versatile epoxy casting system developed
for high performance, production potting and encapsulating appli-
cations where low shrinkage and rapid air evacuation are required.
This formulation has a very low surface tension and a flowable
viscosity, which affords excellent air release. Ther-O-Bond
TM 1500
adhers to rigid plastics and laminates, metals and ceramics, has
a low coefficient of thermal expansion and is readily machined
and shaped with ordinary shop tools. The fully cured epoxy system
is an excellent electrical insulator which provides good resistance
to electrolysis, leakage and corrosion room water, weather, gases
and chemical compounds.
Ther-O-Bond
TM Adhesive
Mix ratio by weight,
100 to 15
resin to hardener:
Mixed viscosity @ 25°C, cps:
1000 - 1500
Work-life @ 25°C
45 Minutes
Gel time @ 25°C
3-6 Hours
Cure schedule @ 25°C
8 Hours
Cure schedule @ 65°C
1 Hour
Cure schedule @ 100°C
0.5 Hour
For smaller applications, Ther-O-Bond
TM 1600 produces a stable,
durable, high-impact bond, with good heat transfer characteris-
tics. It is a thixotropic (smooth paste) thermally conductive epoxy
system used for staking thermistors, diodes, resistors, integrated
circuits and other heat sensitive components to printed circuit
boards. This two-part adhesive develops strong, durable, high
impact bonds at room temperature, which improve heat transfer
while maintaining electrical insulation. Ther-O-bond
TM 1600 bonds
readily to itself, to metals, silica, steatie, alumina, sapphire and
other ceramics, glass, plastics and many other materials because
its coefficient of thermal expansion provides a good match for
those materials over a fairly wide temperature range.
Mix ratio by weight,
100 to 5
resin to hardener:
Mixed viscosity @ 25°C, cps:
33,000
Work-life @ 25°C
45 Minutes
Gel time @ 25°C
3-6 Hours
Cure schedule @ 25°C
8 Hours
Cure schedule @ 65°C
1 Hour
Cure schedule @ 100°C
0.5 Hour
HANDLING CHARACTERISTICS
Color
Blue
Specific gravity:
2.30
Operating temp, °C
-70 to 115
Hardness, shore D:
90
Izod impact, F1 Lbs/Inch of notch
0.49
Thermal
0.85
conductivity W/(m-°C)
C.T.E. (ppm/°C)
25
Tensile strength (@25°C)
9200 psi
Tensile lap shear, psi
2900
Dielectric strength (volts/mil)
410
Dielectric constant (1 KHz @ 25°C)
5.9
Dissipation factor, KH@ 25°C
5.9
Shelf life
18 months*
Ther-O-Bond
TM 2000 acrylic adhesive cures rapidly
at room temperature, while providing a repairable,
thermally conductive bond.
Color
White
Thermal
0.48
conductivity W/(m-°C)
C.T.E. (ppm/°C)
25
Tensile strength (@25°C)
2360 psi
Dielectric strength (volts/mil)
220
Shelf life
18 months*
Part number
Description
Package/Kit
Size
159900F00000G
Ther-O-BondTM 1500
Resin and hardener
0.946 liter (1 qt)
161000F00000G
Ther-O-BondTM 1600
2-Part plastic kit
10gm (0.35 oz)
164000F00000G
Ther-O-BondTM 1600
2-Part plastic kit
40gm (1.40 oz)
200000F00000G
Ther-O-BondTM 2000
Adhesive syringe
25ml
Activator bottle
13ml
ORDERING INFORMATION
PRODUCT INFORMATION
Ther-O-Bond
TM 1500
Ther-O-Bond
TM 1600
Ther-O-Bond
TM 2000
HANDLING CHARACTERISTICS
PHYSICAL PROPERTIES
Color
Black
Specific gravity
1.5
Operating temp, °C
-60 to 155
Heat distortion temp, °C
100
Hardness, shore D:
88
Thermal
1.26
conductivity W/(m°C)
Compressive strength, psi
14,000
Dissipation factor,
0.01
Self extinguishing:
yes
C.T.E. (ppm/°C)
25
Tensile strength (@25°C)
9200 psi
Dielectric
800
Shelf life
18 months*
PHYSICAL PROPERTIES
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
相關PDF資料 |
PDF描述 |
|---|---|
| MX23A18XF1 | CONN FRONT CAP 18POS SOCKET HSNG |
| 1393139-2 | RELAY GEN PURPOSE 4PDT 10A 115V |
| 533602B02552G | BOARD LEVEL HEAT SINK |
| 3505-28B | CONN LONG EJECTOR LATCH FOR MHDR |
| AXT424114 | CONN HEADER .4MM 24POS SMD |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 592-908A | 制造商:LG Corporation 功能描述:MODULATOR MDG-VA3431 FOR CAMC |
| 59-291 | 制造商: 功能描述: 制造商:undefined 功能描述: |
| 5929-2 | 功能描述:測試電夾 ROTATING MICROGRAB RoHS:否 制造商:Pomona Electronics 類型:Minigrabber clip 顏色:Black |
| 592-922C | 制造商:LG Corporation 功能描述:MODULATOR |
| 592-925E | 制造商:LG Corporation 功能描述:MODULATOR |
發布緊急采購，3分鐘左右您將得到回復。