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參數(shù)資料
| 型號(hào)： | 5962-8770204RA |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | DAC |
| 英文描述： | PARALLEL, WORD INPUT LOADING, 12-BIT DAC, CDIP20 |
| 封裝： | CERAMIC, DIP-20 |
| 文件頁(yè)數(shù)： | 8/10頁(yè) |
| 文件大小： | 166K |
| 代理商： | 5962-8770204RA |
UCSP Package Consideration
For general UCSP package information and PC layout
considerations, please refer to the Maxim Application
Note (Wafer-Level Ultra-Chip-Board-Scale Package).
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical relia-
bility tests. UCSP reliability is integrally linked to the
user’s assembly methods, circuit board material, and
usage environment. The user should closely review
these areas when considering use of a UCSP package.
Performance through Operating Life Test and Moisture
Resistance remains uncompromised as it is primarily
determined by the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a UCSP package. UCSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Information on Maxim’s qualification plan, test
data, and recommendations are detailed in the UCSP
application note, which can be found on Maxim’s web-
site at www.maxim-ic.com.
Chip Information
PROCESS: BiCMOS
MAX4684/MAX4685
0.5
Ω
Ω/0.8Ω
Ω Low-Voltage, Dual SPDT
Analog Switches in UCSP
_______________________________________________________________________________________
7
tr < 5ns
tf < 5ns
50%
VIL
LOGIC
INPUT
RL
50
Ω
COM_
GND
IN_
CL INCLUDES FIXTURE AND STRAY CAPACITANCE.
VOUT = VN_
(
RL
)
RL + RON
VIN_
VIH
tOFF
0
NO_
OR NC
0.9 x V0UT
0.9 x VOUT
tON
VOUT
SWITCH
OUTPUT
LOGIC
INPUT
LOGIC INPUT WAVEFORMS INVERTED FOR SWITCHES
THAT HAVE THE OPPOSITE LOGIC SENSE.
V+
CL
35pF
V+
VOUT
MAX4684
MAX4685
Figure 2. Switching Time
Test Circuits/Timing Diagrams
50%
VIH
VIL
LOGIC
INPUT
VOUT
0.9 x VOUT
tD
LOGIC
INPUT
RL
50
Ω
GND
CL INCLUDES FIXTURE AND STRAY CAPACITANCE.
NO_
IN_
NC_
VOUT
V+
CL
35pF
VN_
COM_
MAX4684
MAX4685
Figure 3. Break-Before-Make Interval
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| 5962-8770204RX | 功能描述:數(shù)模轉(zhuǎn)換器- DAC .ATCHED 12-BIT MDAC IC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| 5962-87702052A | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| 5962-87702062A | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| 5962-8770601GA | 制造商:Analog Devices 功能描述:OP Amp Single GP ±22V 8-Pin TO-99 制造商:Rochester Electronics LLC 功能描述:JFET INPUT OP AMP IC - Bulk |
| 5962-8770601PA | 制造商:Analog Devices 功能描述:OP Amp Single GP ±22V 8-Pin CDIP 制造商:Rochester Electronics LLC 功能描述:JFET INPUT OP AMP IC - Bulk |
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