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參數資料
| 型號： | 5962-9163401MPX |
| 廠商： | INTERSIL CORP |
| 元件分類： | 運算放大器 |
| 英文描述： | OP-AMP, 750 uV OFFSET-MAX, 100 MHz BAND WIDTH, CDIP8 |
| 封裝： | CERDIP-8 |
| 文件頁數： | 10/10頁 |
| 文件大小： | 318K |
| 代理商： | 5962-9163401MPX |
9
HA-5221
Ceramic Leadless Chip Carrier Packages (CLCC)
D
j x 45o
D3
B
h x 45o
A
A1
E
L
L3
e
B3
L1
D2
D1
e1
E2
E1
L2
PLANE 2
PLANE 1
E3
B2
0.010
E H
S
0.010
E F
S
-E-
0.007
E F
M
S HS
B1
-H-
-F-
J20.A MIL-STD-1835 CQCC1-N20 (C-2)
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.060
0.100
1.52
2.54
6, 7
A1
0.050
0.088
1.27
2.23
-
B
----
-
B1
0.022
0.028
0.56
0.71
2, 4
B2
0.072 REF
1.83 REF
-
B3
0.006
0.022
0.15
0.56
-
D
0.342
0.358
8.69
9.09
-
D1
0.200 BSC
5.08 BSC
-
D2
0.100 BSC
2.54 BSC
-
D3
-
0.358
-
9.09
2
E
0.342
0.358
8.69
9.09
-
E1
0.200 BSC
5.08 BSC
-
E2
0.100 BSC
2.54 BSC
-
E3
-
0.358
-
9.09
2
e
0.050 BSC
1.27 BSC
-
e1
0.015
-
0.38
-
2
h
0.040 REF
1.02 REF
5
j
0.020 REF
0.51 REF
5
L
0.045
0.055
1.14
1.40
-
L1
0.045
0.055
1.14
1.40
-
L2
0.075
0.095
1.91
2.41
-
L3
0.003
0.015
0.08
0.38
-
ND
5
3
NE
5
3
N20
20
3
Rev. 0 5/18/94
NOTES:
1. Metallized castellations shall be connected to plane 1 terminals
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
2. Unless otherwise specied, a minimum clearance of 0.015 inch
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)
3. Symbol “N” is the maximum number of terminals. Symbols “ND”
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
4. The required plane 1 terminals and optional plane 2 terminals (if
used) shall be electrically connected.
5. The corner shape (square, notch, radius, etc.) may vary at the
manufacturer’s option, from that shown on the drawing.
6. Chip carriers shall be constructed of a minimum of two ceramic
layers.
7. Dimension “A” controls the overall package thickness. The maxi-
mum “A” dimension is package height before being solder dipped.
8. Dimensioning and tolerancing per ANSI Y14.5M-1982.
9. Controlling dimension: INCH.
相關PDF資料 |
PDF描述 |
|---|---|
| 5962-9163401M2X | OP-AMP, 750 uV OFFSET-MAX, 100 MHz BAND WIDTH, CQCC20 |
| 5962-9166501HXA | OP-AMP, 2000 uV OFFSET-MAX, MBCY12 |
| 5962-9166501HXC | OP-AMP, 2000 uV OFFSET-MAX, MBCY12 |
| 5962-9166501HXX | OP-AMP, 2000 uV OFFSET-MAX, MBCY12 |
| 5962-9170001HXA | OP-AMP, 3000 uV OFFSET-MAX, MBFM8 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 59629163901 | 制造商:Texas Instruments 功能描述:DS26C31MW/883Q |
| 59629163901M2A | 制造商:NATIONAL 功能描述:DS26C31ME/883 |
| 5962-9163901M2A | 功能描述:緩沖器和線路驅動器 RoHS:否 制造商:Micrel 輸入線路數量:1 輸出線路數量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| 59629163901MEA | 制造商:Texas Instruments 功能描述:Quad Transmitter RS-422 16-Pin CDIP |
| 5962-9163901MEA | 功能描述:緩沖器和線路驅動器 RoHS:否 制造商:Micrel 輸入線路數量:1 輸出線路數量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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